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作 者:梁冬冬 任杰 刘欢 杨映新 Atsha Ambar 孙莹[3] 王聪 LIANG Dongdong;REN Jie;LIU Huan;YANG Yingxin;ATSHA Ambar;SUN Ying;WANG Cong(School of Energy and Power Engineering,Beihang University,Beijing 100191,China;School of Integrated Circuit Science and Engineering,Beihang University,Bejing 100191,China;School of Physics,Beihang University,Beijing 100191,China)
机构地区:[1]北京航空航天大学能源与动力工程学院,北京100191 [2]北京航空航天大学集成电路科学与工程学院,北京100191 [3]北京航空航天大学物理学院,北京100191
出 处:《硅酸盐学报》2024年第7期2175-2186,共12页Journal of The Chinese Ceramic Society
基 金:国家自然科学基金项目(52272264,51972013)。
摘 要:辐射致冷柔性薄膜作为冷却电子器件的候选材料受到广泛关注。然而材料和制备工艺的限制,很难同时具备优异的辐射致冷性能和热稳定性。通过溶胶凝胶法制备了Al_(2)O_(3)掺杂无色聚酰亚胺(CPI)薄膜,不仅利用Al_(2)O_(3)声子–增强共振增强了红外辐射,而且超细Al_(2)O_(3)纳米粒子与分子链的相互作用提高了热稳定性。结果表明:Al_(2)O_(3)掺杂CPI/Ag复合膜随着Al_(2)O_(3)含量增加,中红外发射率逐渐增加而太阳光谱反射率逐渐减小,其中5%(质量分数)Al_(2)O_(3)掺杂CPI/Ag复合膜具有高的太阳光谱(0.4~2.5μm)反射率(91.12%)和中红外(5~20μm)发射率(92.15%)。在阳光直射下,其最大冷却温度比环境温度低7.7℃,可降低铝制器件表面温度最大11.1℃。此外,该复合膜表现出优异的热稳定性(玻璃化转化温度约为328℃和热分解温度约为554℃)。该研究结果为电子器件和航天器附件的高效辐射致冷提供了有效的策略。Introduction The famous“10℃law”indicates that the reliability of electronic devices is closely related to the temperature,i.e.,the reliability can be reduced by 50%for every 10℃increase in temperature when the temperature of electronic devices exceeds80℃.It is thus extremely important to discharge the waste heat of electronic devices in time to achieve an efficient device cooling.Heat transfer methods include heat conduction,heat convection and heat radiation.Conventional air-cooled and liquid-cooled achieve cooling via heat convection and heat conduction.In addition,the cooling technologies also include magnetic cooling(i.e.,magneto-thermal effect),phase change cooling(i.e.,phase change heat storage)and thermoelectric cooling(i.e.,the Peltier effect).With the high integration and miniaturization of electronic devices,especially flexible electronic devices limited by size and deformation,conventional cooling technologies are no longer applicable.The newly flexible radiative cooling films with zero power consumption become potential candidates for cooling electronic devices and are expected to promote the development of the national dual-carbon cause,which can emit heat to outer space through thermal radiation and reject solar irradiance.However,it is extremely difficult to combine outstanding radiative cooling performance with excellent thermostability limited by materials and preparation process.In this paper,Al_(2)O_(3)-doped colorless polyimide hybrid films were prepared by a sol–gel method.The infrared radiation enhanced by Al_(2)O_(3) phonon-enhanced resonance and the higher thermostability because of the interaction of Al_(2)O_(3) nanoparticles with the molecular chains were analyzed.Methods TFMB(0.3657 g)was mixed with DMAc(6 m L)under electromagnetic stirring at 0℃.Al(OH)_(3) sol at different contents(i.e.,0%,5%,10%,15%,and 20%,in mass fraction)was added to the solution above.An accurately weighed 6FDA(0.5036 g)was sequentially added to a trident flask in batches for 1 h,and then stirred con
分 类 号:TB34[一般工业技术—材料科学与工程]
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