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作 者:高翔 Gao Xiang(Zhongke Aerotech(Beijing)Co.,Ltd.,Beijing 101116,China)
机构地区:[1]中科艾尔(北京)科技有限公司,北京101116
出 处:《机械管理开发》2024年第7期127-128,131,共3页Mechanical Management and Development
摘 要:MGS基块作为半导体集成气路传输中底部集成模块的搭建零件,MGS基块内有气路通道,加工后的气路通道的孔端面需用堵帽进行焊接封堵,MGS基块与堵帽焊接后同轴度要求在0.05 mm以内,以保证MGS基块拼搭的定位精度及MGS基块使用性能。为提高焊接质量及焊接过程中受零件精度影响出现焊缝质量不稳定等问题,设计一种半导体基块的对中焊接工装,用于保证焊缝质量和焊接精度。MGS base block as the semiconductor integrated gas transmission in the bottom of the integrated module parts,MGS base block has a gas channel,the processing of the gas channel hole end face needs to be welded with the plug cap sealing,MGS base block and the plug cap welded coaxiality is required to be within 0.05 mm,in order to ensure that the positioning accuracy of the MGS base block collocation and the use of the performance of the MGS base block.In order to improve the welding quality and the welding process by the precision of the parts affected by the weld quality instability and other issues,the design of a semiconductor base block of the alignment welding tooling,used to ensure the quality of the weld and welding precision.
分 类 号:TN305[电子电信—物理电子学] TG44[金属学及工艺—焊接]
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