温度冲击下IGBT高铅焊料层的组织演变与裂纹扩展  

Microstructure evolution and crack propagation of IGBT high lead solder layer under temperature shock

作　　者：周龙早 杨凯[1] 吴丰顺[1] 丁立国 ZHOU Longzao;YANG Kai;WU Fengshun;DING Liguo(School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;Chengdu Silan Semiconductor Manufacturing Co.Ltd.,Chengdu 610404,China)

机构地区：[1]华中科技大学材料科学与工程学院,湖北武汉430074 [2]成都士兰半导体制造有限公司,四川成都610404

出　　处：《华中科技大学学报（自然科学版）》2024年第6期102-109,共8页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家自然科学基金资助项目(62074062)。

摘　　要：采用三种高铅焊料(Pb90Sn10,Pb92.5Sn5Ag2.5,Pb95.5Sn2Ag2.5)连接绝缘栅双极晶体管(IGBT)芯片与Cu框架,分析了温度冲击下焊料层组织的演变与裂纹的扩展.研究结果发现:焊料界面上的金属间化合物随着温度冲击次数的增加而增加;Ag3Sn向焊料基体的移动产生应力集中,降低了焊料的可靠性;在250次温度冲击后焊料内出现裂纹,裂纹从焊料层与芯片界面的边角萌生,并沿界面向焊料层中心扩展;Pb95.5Sn2Ag2.5的抗裂能力最高,Pb92.5Sn5Ag2.5次之,Pb90Sn10最差;该结果可为绝缘栅双极晶体管器件的疲劳可靠性研究提供支撑.Three kinds of high lead solder(Pb90Sn10,Pb92.5Sn5Ag2.5,Pb95.5Sn2Ag2.5)were used to connect insulated gate bipolar transistor(IGBT)chip to copper frame,and the microstructure evolution and crack propagation of the solder layer under temperature impact were studied.Research results show that the intermetallic compounds on the solder interface increase with the increase of temperature shock times.The movement of Ag3Sn to solder matrix results in stress concentration,which reduces the reliability of solder.The cracks appear in the solder after 250 temperature shocks.The cracks start from the edge of the interface between the solder layer and the chip,and spread along the boundary towards the center of the solder layer.The crack resistance of Pb95.5Sn2Ag2.5 is the highest,followed by Pb92.5Sn5Ag2.5,and Pb90Sn10 is the worst.The results can provide support for the fatigue reliability research of IGBT devices.

关 键 词：绝缘栅双极晶体管器件 高铅焊料 组织演变 裂纹扩展 温度冲击 

分 类 号：TG405[金属学及工艺—焊接]