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作 者:蒙品品 张晓波 Meng Pinpin;Zhang Xiaobo(State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals,School of Materials Science and Engineering,Lanzhou University of Technology,Lanzhou Gansu 730050,China)
机构地区:[1]兰州理工大学材料科学与工程学院有色金属加工与再利用省部共建国家重点实验室,甘肃兰州730050
出 处:《金属热处理》2024年第7期267-273,共7页Heat Treatment of Metals
基 金:国家自然科学基金(51601084)。
摘 要:采用OM、SEM、拉伸试验对不同工艺退火后T2纯铜的显微组织和力学性能进行研究。结果表明,退火温度的升高与退火时间的延长导致了T2纯铜微观组织中再结晶组织以及退火孪晶含量增多,进而使得退火纯铜的塑性增强。纯铜经150℃退火60 min后,在晶界强化、位错强化以及孪晶的多重作用下,室温抗拉强度达到了309.1 MPa,断后伸长率为16.7%,相较于原始纯铜室温抗拉强度提升了11.6%,伸长率提升了34.7%。通过高温拉伸试验得出,纯铜在100℃退火30 min后表现出优异的热稳定性。Microstructure and mechanical properties of T2 pure copper annealed with different processes were studied by using OM,SEM and tensile tests.The results show that the increase of annealing temperature and the extension of annealing time lead to increase in the content of recrystallized structure and annealing twin in the microstructure of the pure copper,thereby enhancing the plasticity of annealed pure copper.After annealing at 150℃ for 60 min,the pure copper achieves room temperature tensile strength of 309.1 MPa and elongation after fracture of 16.7% under the multiple effects of grain boundary strengthening,dislocation strengthening and twinning.Compared with the original pure copper,the room temperature tensile strength increases by 11.6% and the elongation increases by 34.7%.According to the tensile test at high temperature,the pure copper exhibits excellent thermal stability after annealing at 100℃ for 30 min.
分 类 号:TG146.1[一般工业技术—材料科学与工程]
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