微细直写掩膜电解加工非晶合金平面微线圈工艺研究  

Microfine direct-write mask electrolytic processing of amorphous alloy planar microcoils

作　　者：毕经新 彭子龙[1,2] 王萌杰 周帅 刘中皓 李一楠[1,2] BI Jingxin;PENG Zilong;WANG Mengjie;ZHOU Shuai;LIU Zhonghao;LI Yinan(Shandong Engineering Research Center for Additive Manufacturing,Qingdao University of Technology,Qingdao 266520,CHN;Key Laboratory of Additive Manufacturing and Applications in Universities of Shandong,Qingdao University of Technology,Qingdao 266520,CHN)

机构地区：[1]青岛理工大学山东省增材制造工程技术研究中心,山东青岛266520 [2]青岛理工大学山东省增材制造(3D打印)技术与应用高校重点实验室,山东青岛266520

出　　处：《制造技术与机床》2024年第8期55-61,共7页Manufacturing Technology & Machine Tool

基　　金：国家自然科学基金项目(51875300,51871128);山东省自然科学基金项目(ZR2023ME194)。

摘　　要：针对掩膜电解加工工艺固化、流程复杂等问题,提出一种基于微细直写聚合物材料的图案化掩膜电解加工方法。对直写掩膜工艺应用于微细电解加工平面线圈工艺进行研究。采用单因素法获得了直写加工参数对掩膜的影响规律。采用正交实验获得了加工电压、阴极振动频率和占空比等工艺参数对成形精度的规律。建立了加工微结构尺寸的预测模型,利用优化的工艺参数在厚度30μm合金薄片上加工出宽度为300μm平面微线圈结构,通过网络分析仪对电流传感效应进行检测,获得了阻抗变化率为3.46%的响应。证明了直写掩膜应用于微细掩膜电解加工的可行性。Aiming at the current mask electrolytic processing process curing,process complexity and other problems,a patterned mask electrolytic processing method based on microfine direct-write polymer materials is proposed.The application of the direct-write mask process to the microfine electrolytic machining planar coil process is investigated.The influence law of direct-write processing parameters on the mask is obtained using the one-factor method.The laws of process parameters such as processing voltage,cathode vibration frequency and duty cycle on forming accuracy were obtained using orthogonal experiments.A prediction model for the dimensions of the processed microstructures was established,and a planar microcoil structure with a width of 300μm was processed on a thin alloy sheet with a thickness of 30μm using the optimized process parameters,and a response with an impedance change rate of 3.46%was obtained by a network analyzer for the detection of the current sensing effect.The feasibility of direct-write mask applied to microfine mask electrolytic processing is demonstrated.

关 键 词：直写掩膜 微细电解加工 非晶合金 工艺规律 参数优化 

分 类 号：TG662[金属学及工艺—金属切削加工及机床]