一种双余度快响应铂电阻温度传感器封装技术研究  

Research on Packaging Technology of Double-Redundant Fast-Response Platinum Resistance Temperature Sensor

作　　者：皮倩倩 王大兴 李涛 傅巍 崔闻 张博涛 PI Qian-qian;WANG Da-xing;LI Tao;FU Wei;CUI Wen;ZHANG Bo-tao(The 49th Research Institute of China Electronic Technology Corporation,Harbin 150028)

机构地区：[1]中国电子科技集团公司第四十九研究所,哈尔滨150001

出　　处：《环境技术》2024年第7期72-76,81,共6页Environmental Technology

摘　　要：针对航空领域温度传感器故障风险进行双路冗余设计,采用高精度薄膜电阻器作为感温芯片,建立双通道独立采集、输出温度信号,采用高性能超薄绝缘材料进行绝缘防护,选用高导热系数的导热硅脂与氧化铝粉结合灌封的方式进行导热灌封,加快动态响应时间。通过ANSYS有限元仿真验证传感器前端保护管耐压性能,并通过封装工艺加工出传感器样品,该样品测试响应时间不大于3 s,双路静态输出误差小于0.3℃。In view of the risk of temperature sensor failure in the aviation field,the dual-channel redundancy design is carried out,the high-precision thin film resistor is used as the temperature sensing chip,the dual-channel independent collection and output temperature signal is established,the high-performance ultra-thin insulating material is used for insulation protection,and the thermal conductivity silicone grease with high thermal conductivity and alumina powder are selected for thermal conductivity potting combined with potting to speed up the dynamic response time.The pressure resistance of the front-end protection tube of the sensor was verified by ANSYS finite element simulation,and the sensor sample was processed through the packaging process,and the test response time of the sample was not more than 3 s,and the dual-channel static output error was less than 0.3℃.

关 键 词：双余度 温度传感器 响应时间 静态输出误差 

分 类 号：TH811[机械工程—仪器科学与技术]