精益涂敷技术在大功率半导体器件散热上的应用及实现  

Lean Coating Technology in High-Power Semiconductor Devices Application and Implementation of Heat Dissipation

作　　者：李新刚 蔡小纯 王川 梁胜新 LI Xin-gang;CAI Xiao-chun;WANG Chuan;LIANG Sheng-xin(Guangzhou kinte industrial Co.,Ltd.,Guangzhou 510860)

机构地区：[1]广州擎天实业有限公司,广州510860

出　　处：《环境技术》2024年第7期141-144,153,共5页Environmental Technology

摘　　要：本文基于导热硅脂对大功率半导体器件散热方面的功效进行研究,通过不同涂敷工艺的温升对比实验,选取最佳工艺范围,总结形成涂敷工艺标准化,为实际生产提供了指导和借鉴作用,将有助于保证涂敷质量,从而达到较好的散热效果。Based on thermal silicone grease studies the effect of high power semiconductor device cooling,through different coating process of temperature contrast experiment,select the best process range,summary form coating process standardization,provides guidance and reference,will help guarantee the quality of coating,so as to achieve good heat dissipation effect.

关 键 词：涂敷 半导体 IGBT 模具 应用 

分 类 号：TM131[电气工程—电工理论与新技术]