PTPC在化学机械平坦化中的应用  

Application of PTPC in Chemical Mechanical Planarization

作　　者：白琨 贾若雨 岳爽 李嘉浪 BAI Kun;JIA Ruoyu;YUE Shuang;LI Jialang(Beijing GEGV Technology Co.,Ltd.,Beijing 100176,China)

机构地区：[1]北京晶亦精微科技股份有限公司,北京100176

出　　处：《电子工业专用设备》2024年第4期45-48,共4页Equipment for Electronic Products Manufacturing

摘　　要：化学机械平坦化(CMP)在铜工艺中需要对晶圆形貌进行精准控制。精确调整过程控制系统(PTPC)利用传感器实时检测晶圆表面铜膜厚度,采用闭环控制实时调整研磨头分区压力。实现了比开环控制更加均匀的薄膜研磨过程,达到了均匀控制晶圆表面薄膜形貌的目的。介绍了PTPC系统的检测原理和控制流程。Chemical mechanical planarization(CMP)needs to control wafer profile accurately in the process of copper.Precise tuning process control(PTPC)can detect the real-time copper thickness by sensor,and adjust head zone pressure by close-loop.This method realizes more uniform of copper film polish and profile control.The detection principle and control flow of PTPC system are introduced.

关 键 词：精确调整过程控制 闭环控制 压力 晶圆表面薄膜形貌 

分 类 号：TN305.2[电子电信—物理电子学]