三维网络填料增强聚合物基复合材料导热性能的研究进展  

Research progress on thermally conductive polymer matrix composites reinforced by three-dimensional network fillers

作　　者：周正荣 颜秀文 何峰 徐冬[1] 黄荣进[1,3] 李来风 ZHOU Zhengrong;YAN Xiuwen;HE Feng;XU Dong;HUANG Rongjin;LI Laifeng(Key Laboratory of Cryogenic Science and Technology,Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing 100190,China;The 48th Research Insititute of CETC,Changsha 410111,China;School of Future Technology,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院理化技术研究所低温科学与技术重点实验室,北京100190 [2]中国电子科技集团公司第四十八研究所(长沙半导体工艺设备研究所),长沙410111 [3]中国科学院大学未来技术学院,北京100049

出　　处：《复合材料学报》2024年第7期3301-3321,共21页Acta Materiae Compositae Sinica

基　　金：中国科学院战略性先导科技专项(B类)(XDB25040300);科技部智能传感器专项资助项目(2022YFB3207500)。

摘　　要：聚合物在超导技术、航天航空、电子电路、动力电池、换热器等领域的应用十分广泛。随着器件的小型化、密集化和高功率,对于整体的散热要求越来越高,但是聚合物作为器件和设备粘接、封装等工艺的关键材料,热导率仅为0.2 W/(m·K),完全不能满足目前的散热需求,因此亟需提升聚合物的导热性能。由于在聚合物基体中构建连续的导热路径能极大提高聚合物的导热系数,往往能提高数倍或数十倍,因此采用三维网络填料增强聚合物导热性能是最为常用的一种方法之一。本文主要对用构建三维网络填料来增强高分子材料的导热性能的相关研究进行了整理,以制备方式的不同,将其归类为自组装法、相分离法、模板法、取向分布法等方法。最后,从制备方法的热导率提高值、可行性、稳定性等方面进行了总结分析,并对三维网络填料增强的聚合物基导热复合材料的未来发展前景进行了展望。Polymer materials find wide applications in various fields such as superconducting technology,aerospace,electronic circuits,power batteries,heat exchangers,among others.With the increasing demands for miniaturization,densification,and high power of devices,the overall heat dissipation requirements have escalated.However,polymers,serving as crucial materials in device encapsulation and bonding processes,exhibit a low thermal conductivity of only 0.2 W/(m∙K),which falls significantly short of current heat dissipation needs.Therefore,there is an urgent need to enhance the thermal conductivity of polymers.Constructing continuous thermal pathways within the polymer matrix has been shown to significantly improve the thermal conductivity,often increasing it several times or even tens of times.Hence,utilizing three-dimensional network fillers to reinforce the thermal conductivity of polymers stands out as one of the most commonly employed methods.Accordingly,this paper organizes relevant studies on enhancing the thermal conductivity of polymeric materials through the construction of three-dimensional network fillers.Based on different preparation methods,these are categorized into self-assembly,phase-separation,template-methods,oriented-distribution methods,among others.Finally,a summary analysis is provided from aspects such as the increase in thermal conductivity values due to preparation methods,feasibility,stability,and prospects for the future development of polymer-based thermally conductive composites reinforced by three-dimensional network fillers.

关 键 词：导热系数 复合材料 聚合物 三维网络增强 无机填料 

分 类 号：TB332[一般工业技术—材料科学与工程]