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作 者:刘传科 何志祝 LIU ChuanKe;HE ZhiZhu(Department of Mechanical Engineering,College of Engineering,China Agricultural University,Beijing 100083,China)
机构地区:[1]中国农业大学工学院机械工程系,北京100083
出 处:《中国科学:技术科学》2024年第7期1305-1317,共13页Scientia Sinica(Technologica)
基 金:国家自然科学基金(批准号:52076213)资助项目。
摘 要:本文提出了一种用于高热流密度电子器件热管理的新型液态金属小通道散热方法,研制了一种可提供4.55 L/min流量和64.2 kPa驱动压头的紧凑型感应电磁泵.搭建了基于电磁驱动高热通量液态金属热控平台,实现了热流密度高达249 W/cm^(2)的散热需求.发展了三维流固耦合的多参量优化仿真模型并实验验证了数值模拟有效性.研究发现,低流量下液态金属热容热阻是影响液态金属散热的主要因素(约占总热阻23.6%),优化热源相对位置有利于提高其表面均温性.We propose a novel minichannel heat dissipation approach using a liquid metal for the thermal management of electronic devices with high heat flux density.A compact induction electromagnetic pump with a flow rate of 4.55 L/min and a driving pressure head of 64.2 kPa was developed.Moreover,a liquid metal thermal control platform was constructed based on high heat flux electromagnetic drive to meet the heat dissipation requirements with a high heat flux density of 249 W/cm^(2).A simulation model for optimizing threedimensional fluid-solid coupling multiparameters was designed,and the validity of numerical simulation was verified experimentally.The results reveal that the thermal resistance of the liquid metal heat capacity at a low flow rate is the main factor affecting its heat dissipation(accounting for approximately 23.6%of the total thermal resistance),and its surface temperature uniformity can be enhanced by optimizing the relative position of the heat source.
分 类 号:TN03[电子电信—物理电子学] TK124[动力工程及工程热物理—工程热物理]
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