功率模块随机振动响应分析及疲劳寿命预测  

Random Vibration Response Analysis and Fatigue Life Prediction of Power Module

作　　者：张顺 张金萍[1] ZHANG Shun;ZHANG Jinping(School of Mechanical and Power Engineering,Shenyang University of Chemical Technology,Shenyang 110142,China)

机构地区：[1]沈阳化工大学机械与动力工程学院,沈阳110142

出　　处：《机械工程师》2024年第8期67-70,共4页Mechanical Engineer

摘　　要：针对功率模块在随机振动环境下的可靠性及寿命预测问题,采用变量对比的方法,利用ANSYS进行模态分析和谐响应分析,研究了随机振动载荷下焊料层厚度变化对功率模块焊接应力的影响。在此基础上利用基于高斯分布的Steinberg模型进行随机振动载荷下功率模块的疲劳寿命预测。研究发现,当DBC焊料层厚度增加时,基板焊接应力减小;焊料层材料为SAC305,在基频发生共振时的振动幅值较大且结构的疲劳寿命较长,功率模块的可靠性增加。Aiming at the reliability and life prediction of the power module in the random vibration environment,the method of variable comparison is used to conduct modal analysis and harmonic response analysis using ANSYS,and the effect of the solder layer thickness variation on the welding stress of the power module under random vibration load is studied.On this basis,the Steinberg model based on Gaussian distribution is applied to forecast the fatigue lifetime of power modules under random vibration loads.The study proves that when the thickness of the DBC solder layer increases,the welding stress of the substrate decreases;when the solder layer material is SAC305,the vibration amplitude is larger while the fundamental frequency resonates,the fatigue life of the structure is longer,and the reliability of the power module is increased.

关 键 词：功率模块 随机振动 焊接应力 寿命预测 

分 类 号：T305[一般工业技术]