三款MEMS车用油箱压力传感器工艺对比与改进  

Technology comparison and improvement of three MEMS automotive fuel tank pressure sensors

作　　者：张允峰 卓义盛 莫梦婷 ZHANG Yunfeng;ZHUO Yisheng;MO Mengting

机构地区：[1]上汽通用五菱汽车股份有限公司技术中心,广西柳州545007

出　　处：《现代机械》2024年第3期45-47,共3页Modern Machinery

摘　　要：温度漂移是MEMS半导体特性固有的常见问题,其不仅发生在芯片级,同样也会受传感器组装工艺水平影响。本文通过性能对比调查,发现传感器组装工艺中的Pin脚焊接环节引起的PCB不平、涂胶不均造成了温度漂移问题。通过工艺优化后,温度漂移问题得到解决,产品精度显著提高。Temperature drift is a common intrinsic problem of the MEMS semiconductor,it not only happens in the chip level,but also is affected by the sensor assembly process.Based on the performance comparison,we have found that the rough PCB and uneven coating caused by the welding of the Pin feet during the assembly process of the sensor would result in temperature drift.Through process optimization,the temperature drift problem is solved,and the product precision is improved significantly.

关 键 词：MEME 压力传感器 温度漂移 精度 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]