电源储能类大尺寸PCB翘曲分析及改善  

Analysis and improvement of the warping of large assembled PCB boards for power storage

作　　者：陈世金 韩志伟 徐缓 周国云 王守绪 CHEN Shijin;HAN Zhiwei;XU Huan;ZHOU Guoyun;WANG Shouxu(Bomin Electronics Co.,Ltd.,Meizhou 514768,Guangdong,China)

机构地区：[1]博敏电子股份有限公司省市共建高密度混合集成印制电路广东省重点实验室,广东梅州514768

出　　处：《印制电路信息》2024年第8期9-14,共6页Printed Circuit Information

基　　金：梅州市“鸿雁计划”项目(2024HY001TD002);梅州市科技计划项目(2023A0102001);省市共建高密度混合集成印制电路广东省重点实验室项目。

摘　　要：对电源储能厚铜类大拼版印制电路板(PCB)产生板翘问题的原因进行分析,主要涉及材料、加工工艺及回流焊后板翘的变化情况。通过正交试验设计(DOE)验证电源储能厚铜类大拼板PCB出现板翘的真正原因,最终得出其板翘与基板材料及半固化片(PP)的匹配有重要关系。同时,过程中的压合参数管控、烤板参数等会对改善板翘有一定的改进作用。最后提出相应改善措施,以期为同行企业技术工作者提供参考。The reasons for the warping problem of the thick copper type large assembled printed circuit board(PCB)for power storage are analyzed,especially involving the changes of the warping under different conditions of materials,processing technology and reflow soldering.Through the orthogonal design of experiments(DOE)to verify the true cause of the warping of the power storage thick copper type large assembled PCB,it is finally concluded that the warping has an important influence on the matching of the substrate material and prepreg(PP)(adhesive sheet).At the same time,the control of the lamination parameters and the baking plate parameters in the process will have a certain promoting effect on improving the warping.At last,improvement measures are also proposed,so as to provide a reference for the technical workers of peer enterprises to solve such problems.

关 键 词：大拼版印制电路板(PCB) 板翘 经纬向 混压 

分 类 号：TN41[电子电信—微电子学与固体电子学]