Ag-GNSs/Sn-Ag-Cu复合钎料焊点的润湿性能及界面生长特征研究  

Research on Wettability and Interface Growth Characterization of Ag-GNSs/Sn-Ag-Cu Composite Solder Joints

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作  者:高子旋 屈敏 康博雅 崔岩 GAO Zixuan;QU Min;KANG Boya;CUI Yan(School of Mechanical and Material Engineering,North China University of Technology,Beijing 100144,China)

机构地区:[1]北方工业大学机械与材料工程学院,北京100144

出  处:《热加工工艺》2024年第13期50-54,共5页Hot Working Technology

基  金:国家自然科学基金项目(51604012)。

摘  要:采用Ag涂覆石墨烯纳米片(Ag-GNSs)作为增强体,制备Sn-3.0Ag-0.5Cu-(Ag-GNSs)新型复合无铅钎料,然后在Cu基板上制备了钎料焊点,并进行了150℃不同时长的等温时效处理,研究了不同含量的Ag-GNSs对无铅钎料Sn-3.0Ag-0.5Cu的润湿性、Cu基板/钎料界面金属间化合物(IMC)生长特性的影响。结果表明,适量的Ag-GNSs可以显著地改善钎料的润湿性,当Ag-GNSs含量达到0.05wt%时润湿性最佳,与Sn-3.0Ag-0.5Cu钎料相比润湿角降低了54.43%。随着等温时效时间的延长,IMC层厚度增大,其生长行为由扩散控制。Ag-GNSs的添加可以抑制IMC层的生长,当Ag-GNSs的含量为0.05wt%时扩散系数达到最小值2.356×10^(-18)m^(2)/s。在0~0.2wt%范围内,Ag-GNSs的最佳添加量为0.05wt%。Taking Ag coated graphene nanosheets(Ag-GNSs)as the reinforcement,new composite lead-free solders Sn-3.0Ag-0.5Cu-(Ag-GNSs)were prepared.The solder joints were prepared on the Cu matrix,and the isothermal aging treatment at 150℃for different time was carried out.The effects of different content of Ag-GNSs on the wettability of the lead-free solder Sn-3.0Ag-0.5Cu and characteristic of intermetallic compound(IMC)at the interface between Cu matrix and solder were studied.The results show that appropriate amount of Ag-GNSs can significantly improve the wettability of the solder,the wettability is best when the Ag-GNSs content reaches 0.05wt%,and the wetting angle is reduced by 54.43%compared with that of Sn-3.0Ag-0.5Cu solder.The IMC layer becomes thicker with the extension of the isothermal aging time,and its growth behavior is controlled by diffusion.The addition of Ag-GNSs can inhibit the growth of the IMC layer.The diffusion coefficient reaches the minimum value of 2.356×10^(-18)m^(2)/s when the Ag-GNSs content is 0.05wt%.The optimal addition amount of Ag-GNSs is 0.05wt%in the range of 0-0.2wt%.

关 键 词:Ag涂覆石墨烯纳米片(Ag-GNSs) Sn-3.0Ag-0.5Cu钎料 润湿性 IMC层 

分 类 号:TG425.1[金属学及工艺—焊接]

 

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