高温共烧陶瓷大深径比通孔填充工艺改良  

Improvement of High Aspect Ratio Via Filling Process of High Temperature Co-Fired Ceramics

作　　者：刘曼曼 淦作腾[1] 杨德明 马栋栋 程换丽 王杰 刘冰倩 郭志伟 Liu Manman;Gan Zuoteng;Yang Deming;Ma Dongdong;Cheng Huanli;Wang Jie;Liu Bingqian;Guo Zhiwei(The 13^(th) Research Institute,CETC,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2024年第8期52-57,共6页Micronanoelectronic Technology

摘　　要：通孔填充是高温共烧陶瓷(HTCC)制作流程中的关键工艺之一,直接影响着元件内部不同层之间电气连接的可靠性。此工艺主要是对冲孔后的陶瓷片进行通孔金属化,即将具有导通作用的金属浆料填充进通孔内。随着通孔深径比增大,常规通孔填充技术无法保证通孔填充质量,通孔填充工艺急需改良。影响通孔填充质量的因素较多,分析了浆料黏度、填孔压力、刮刀速度、刮刀硬度对大深径比通孔填充质量的影响。研究结果表明调整填孔压力、调整浆料黏度及降低刮刀速度均能改善通孔填充效果;刮刀硬度对填孔效果影响较大,当刮刀硬度降低至邵氏A60°~A70°时可保证大深径比通孔填充质量。这一研究结果可为高温共烧陶瓷填孔工艺中通孔填充质量的改善提供参考。Via filling is one of the key processes in the production process of high temperature cofired ceramic(HTCC),which directly affects the reliability of electrical connection between different layers within the component in HTCC.The process is mainly to metallize the punched ceramic sheet,that is,to fill the via with metal slurry with conductive effect.With the increase of the aspect ratio of via,the conventional via filling technology can't guarantee the via filling quality.The via filling process needs to be improved.There were many factors to affect the via filling quality.The effects of slurry viscosity,filling pressure,scraper speed and scraper hardness on the filling quality of via with high aspect ratio were analyzed.The research results shows that the via filling effect can be improved by adjusting the filling pressure,adjusting the slurry viscosity and reducing the scraper speed.The scraper hardness has a great influence on the effect of via filling.When the scraper hardness is reduced to Shore A60°-A70°,the filling quality of via with high aspect ratio can be guaranteed.This research results can provide reference for improving via filling quality in via filling process of HTCC.

关 键 词：高温共烧陶瓷(HTCC) 大深径比 通孔填充 刮刀硬度 浆料黏度 填孔压力 刮刀速度 

分 类 号：TN304.82[电子电信—物理电子学]