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作 者:张佳琦 Zhang Jiaqi(The 13^(th) Research Institute,CETC,Shijiazhuang 050051,China)
机构地区:[1]中国电子科技集团公司第十三研究所,石家庄050051
出 处:《微纳电子技术》2024年第8期86-92,共7页Micronanoelectronic Technology
摘 要:为满足电子产业对电镀镍层更高的要求,以可伐合金盖板与陶瓷外壳为载体进行电镀氨基磺酸镍研究。在电镀过程中改变温度、pH值、电流密度等工艺参数后对氨基磺酸镍的镀层厚度、孔隙率与抗盐雾性能进行测试,得出了不同工艺参数对氨基磺酸镍镀层均一性以及耐腐蚀性能的影响规律。结果显示,在镀液温度与电流密度一定的情况下,当pH=4时,镀层均一性最好;在镀液温度与pH值一定的情况下,镀层均一性随着电流密度的增加而变差;在电流密度与pH值一定的情况下,镀液温度对镀层均一性无显著影响。在0.5~2 A/dm^(2)电流密度内,电流密度越高,耐腐蚀性越好。In order to meet the higher requirement of electroplating nickel coating in electronic industry,nickel sulfamate electroplating was studied with Kover alloy cover plates and ceramic shells as carrier.The coating thickness,porosity and salt spray resistance of nickel sulfamate were tested after changing the process parameters such as temperature,pH value and current density during the electroplating process.The effect laws of different process parameters on the uniformity and corrosion resistance of nickel sulfamate coating were obtained.The results show that when pH value is 4,the uniformity of coating is the best under the condition of constant bath temperature and current density.The uniformity of coating decreases with the increase of current density under the condition of constant bath temperature and pH value.The bath temperature has no significant effect on the uniformity of coating when the current density and pH value are constant.In the current density of 0.5-2 A/dm^(2),the corrosion resistance becomes better with the increase of the current density.
分 类 号:TQ153[化学工程—电化学工业]
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