印制电路板微短不良问题的探讨  

Exploration of the problem of micro-short defects on printed circuit boards

作　　者：邹金龙 刘飞艳 郑有能 刘志坚 宋建远 Zou Jinlong;Liu Feiyan;Zheng Youneng;Liu Zhijian;Song Jianyuan

机构地区：[1]江门崇达电路技术有限公司,广东省智能工控印制电路板工程技术研究中心,广东江门529000

出　　处：《印制电路资讯》2024年第4期72-75,共4页Printed Circuit Board Information

摘　　要：微短不良是导致印制电路板(PCB)产品报废的常见问题之一,对PCB有功能性影响。本文以实际生产为基础,通过一系列验证实验,多种途径追踪分析,对微短不良问题的根本成因进行了研究和讨论。Micro-short defects are one of the common problems that lead to the scrapping of printed circuit board(PCB)products and has a functional impact on the PCB.This paper is based on actual production,through a series of validation experiments,a variety of ways to track and analyse the root causes of the micro-short defective problems are studied and discussed.

关 键 词：印制电路板 微短不良 盲孔偏位 激光钻孔 

分 类 号：TN4[电子电信—微电子学与固体电子学]