蓝宝石切割研磨及抛光技术研究进展  

Research Progress of Sapphire Cutting,Grinding and Polishing Technology

作　　者：康森 鲁雅荣 李宁 Kang Sen;Lu Yarong;Li Ning(TDG Yinxia New Material Co.,Ltd.,Ningxia,750021;School of Material Science&Engineering,North Minzu University,Ningxia,750021)

机构地区：[1]天通银厦新材料有限公司,宁夏750021 [2]北方民族大学材料科学与工程学院,宁夏750021

出　　处：《当代化工研究》2024年第15期24-26,共3页Modern Chemical Research

基　　金：银川市科技计划项目“多线切割蓝宝石晶体残余应力及工艺改善研究”(项目编号:2022ZDGX15)。

摘　　要：蓝宝石晶体由于其高硬度、良好的化学、光学特性,被广泛应用于许多领域。但蓝宝石晶体本身的高硬度、高脆性和高耐蚀性,使其切割、研磨及抛光难度增加。本文介绍了蓝宝石加工技术的研究进展,探讨了蓝宝石加工过程中存在的问题,分析了提高蓝宝石切割、研磨和抛光技术的工艺措施,提出了蓝宝石切割研磨和抛光技术的发展方向。Sapphire crystal is widely used in many fields because of its high hardness,good chemical and optical properties.However,the high hardness,high brittleness and high corrosion resistance of sapphire crystal itself make it difficult to cut,grind and polish.This paper introduces the research progress of sapphire processing technology,discusses the problems existing in sapphire processing,analyzes the technological measures to improve sapphire cutting,grinding and polishing technology,and puts forward the development direction of sapphire cutting grinding and polishing technology.

关 键 词：蓝宝石 切割 研磨 抛光 

分 类 号：TG174.44[金属学及工艺—金属表面处理]