电路防护用聚对二甲苯的耐恶劣环境性能研究  

Harsh Environment Resistance of Parylene Used to Protect ICs

在线阅读下载全文

作  者:李菁萱 冯小成 荆林晓 井立鹏 李洪剑 王勇 LI Jingxuan;FENG Xiaocheng;JING Linxiao;JING Lipeng;LI Hongjian;WANG Yong(Beijing Microelectronics Technology Institute,Beijing 100076,P.R.China)

机构地区:[1]北京微电子技术研究所,北京100076

出  处:《微电子学》2024年第3期517-522,共6页Microelectronics

摘  要:聚对二甲苯具有防潮、气体隔绝、电绝缘等优点,可广泛应用于集成电路领域。文章针对聚对二甲苯的耐恶劣环境性能进行研究,研究其在热氧老化、紫外老化、温度循环及寿命试验条件下的退化情况。结果表明,聚对二甲苯在热氧、紫外等环境下易发生退化,应该避免暴露在此类环境下。在温度循环及寿命试验条件等环境下性能下降不明显,耐电性能仅与沉积厚度有关。Parylene can be widely used in integrated circuits based on its special properties of moisture resistance,gas isolation,and electrical insulation.In this study,we evaluated the resistance of parylene to harsh environments in terms of material degradation under the conditions of thermal oxygen aging,ultraviolet aging,and thermal cycle and life tests.The results of the thermal-oxidative aging and ultraviolet aging tests demonstrate that parylene should not be exposed to such environments because degradation could easily occur.However,the degradation of parylene is unnoticeable under the conditions of thermal cycle and life tests.Furthermore,the results demonstrate that the breakdown resistance is related only to the thickness of the deposited layer and the correlation is positive.

关 键 词:聚对二甲苯 隔离防护 可靠性评估 环境老化 

分 类 号:TN406[电子电信—微电子学与固体电子学]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象