一种Ku频段高密度集成的陶瓷SiP封装R组件的设计  

Design of a high density and high integration Ku-band R module based-on ceramic systems-in-package

作　　者：罗里 Luo Li(Southwest China Institute of Electronic Technology,Chengdu 610036,China)

机构地区：[1]中国西南电子技术研究所,四川成都610036

出　　处：《电子技术应用》2024年第8期108-113,共6页Application of Electronic Technique

摘　　要：针对机载卫星通信天线尺寸小、重量轻、可靠性强的需求,结合多层陶瓷转接板布线灵活、重量轻的特点,BGA封装I/O口多、体积小的优势,提出了一种基于HTCC工艺SiP-BGA封装架构的2×4通道Ku频段双极化R组件的设计方法。利用电磁仿真软件对组件中高密度射频垂直过渡互联结构进行了仿真设计,同时设计了一款小型化薄膜功分器,以实现4通道接收信号的合成;此外,为确保组件的射频性能及工程可实现性,对整个组件的通道隔离度、散热性进行了仿真计算;最后研制出小型化、高集成度的2×4通道Ku频段R组件,其体积为13 mm×12.5 mm×2.5 mm,重量小于4 g。组件电性能测试结果与仿真设计结果吻合良好,测试结果表明,该组件在10~12.8 GHz频段内合成增益大于23 dB,输入P-1dB不小于-5 dBm。A small,lightweight and strong reliability of T/R module is strongly required for novel airborne satellite communication antennas.This paper proposes a design method for a 2×4 channel Ku-band dual-polarization R module based on a system in package with ball grid array(SIP-BGA)using high temperature cofired ceramic(HTCC)technology,which takes the advantages of the high circuit density and lightweight of multi-layer ceramics and the advantages of small size of BGA package that provides more I/O ports.Firstly,the high-density RF vertical interconnect structures are simulated and optimized by electromagnetic simulation software.Meanwhile,a miniaturized four-way power combiner based on thin film is designed.Channel isolation and heat dissipation of the entire component are then simulated to ensure both the RF performance and engineering feasibility of the component.Finally,a compact and highly integrated 2×4 channel Ku band R module,measuring 13 mm×12.5 mm×2.5 mm in volume and weighing less than 4 g,is successfully developed.Test results confirmed the good performance of the proposed circuit,the result demonstrates that the gain of R module exceeds 23 dB,and the input P-1dB is higher than-5 dBm within the frequency range of 10~12.8 GHz.

关 键 词：有源相控阵 KU频段 SIP R组件 

分 类 号：TN61[电子电信—电路与系统]