Boring holes in Au nanoplates by active surface etching  

作　　者：Haiyang Hu Yuntao Wang Qian Wang Xudong Peng An Su Hong Wang Hongyu Chen 

机构地区：[1]Institute of Advanced Synthesis(IAS)and School of Chemistry and Molecular Engineering,Jiangsu National Synergetic Innovation Centre for Advanced Materials,Nanjing Tech University,Nanjing 211816,China [2]Department of Environmental Science and Engineering,University of Science and Technology of China,Hefei 230026,China [3]Department of Chemistry,School of Science and Key Laboratory for Quantum Materials of Zhejiang Province,Research Center for Industries of the Future,Westlake University,Hangzhou 310030,China [4]Institute of Natural Sciences,Westlake Institute for Advanced Study,Hangzhou 310024,China

出　　处：《Nano Research》2024年第9期8610-8617,共8页纳米研究（英文版）

基　　金：the financial support from the National Natural Science Foundation of China(Nos.91956109,92356310,and 22075137);Zhejiang Provincial Natural Science Foundation of China:Major Program(No.2022XHSJJ002);Leading Innovative and Entrepreneur Team Introduction Program of Zhejiang(No.TD2022004);Foundation of Westlake University.

摘　　要：In contrast to the conventional etching that makes nanoparticles rounder and our previous sharpening etching mode that causes serrated edges,here,we developed a new boring etching mode that targets the faces of Au nanoplates to make holes.The critical factors are the pre-incubation step with the ligand 2-mercapto-5-benzimidazolecarboxylic acid(MBIA)and the subsequent removal of excess ligands in the solution.Thus,etching is focused onto the few sites with initial loss of ligands,which cannot be quickly replaced.The choice of ligand MBIA is also of importance,as it carries negative charge and repels each other.Its inability of forming a dense layer probably plays a critical role in the site-selectivity for faces,because ligands at the higher curvature edges and corners are expected to have less repulsion.The etching results from the comproportionation reaction between Au3+and Au0 in the nanoplates,where Br-coordination to Au and the extra stabilization from cetyltrimethylammonium bromide(CTAB)are essential.We believe that the ability of boring holes is an important tool for future synthetic designs.

关 键 词：Au nanoplates active surface etching boring etching mode cetyltrimethylammonium bromide(CTAB)passivation HOLES 

分 类 号：TB383[一般工业技术—材料科学与工程]