环氧树脂固化促进剂的研究及应用  

Research and application of epoxy resin curing accelerator

作　　者：李栓 张宝艳 杨继萍[2] 张思 白钰 王伟翰 Li Shuan;Zhang Baoyan;Yang Jiping;Zhang Si;Bai Yu;Wang Weihan(AVIC Manufacturing Technology Institute Composite Technology Center,Beijing 101300,China;School of Materials Science and Engineering,Beihang University,Beijing 100191,China)

机构地区：[1]中国航空制造技术研究院复合材料技术中心,北京101300 [2]北京航空航天大学材料科学与工程学院,北京100191

出　　处：《中国胶粘剂》2024年第8期9-15,共7页China Adhesives

摘　　要：环氧树脂由于其优异的性能,使其在胶粘剂、涂层以及复合材料等领域获得了广泛的应用。为了提高固化速率,同时对于一些热敏感的部件来说,温度是一个重要的指标,需要降低固化温度,因此,加入固化促进剂是必要的。本文主要综述了环氧树脂固化促进剂的研究进展及应用情况,包括叔胺及其盐类固化促进剂、三苯基膦及其鏻盐固化促进剂、取代脲固化促进剂、咪唑及其盐类固化促进剂、三氟化硼胺络合物固化促进剂等,并指出了未来的发展方向。Epoxy resin has been widely used in the fields of adhesives,coatings,and composite materials due to its excellent properties.In order to improve the curing rate,and for some heat sensitive components,temperature is an important indicator,it is necessary to lower the curing temperature.Therefore,it is necessary to add curing accelerator.In this article,the research progress and application of curing accelerators for epoxy resin,including tertiary amine and its salt curing accelerators,triphenylphosphine and its salt curing accelerators,substituted urea curing accelerators,imidazole and its salt curing accelerators,boron trifluoride amine complex curing accelerators,etc.were mainly summarized,and the future development direction was pointed out.

关 键 词：环氧树脂 固化速率 热敏感 固化温度 固化促进剂 发展方向 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TQ430.4