UV光固化可剥离压敏胶带的研制  

Research and development of UV-curing strippable pressure sensitive adhesive tape

作　　者：冯笑 陈亚芹 张旭锋 胡永其 王志宏 李玉川 Feng Xiao;Chen Yaqin;Zhang Xufeng;Hu Yongqi;Wang Zhihong;Li Yuchuan(Shandong Aozo New Materials Co.,Ltd.,Tengzhou 277599,Shandong,China;Lu’nan Research Institute of Beijing Institute of Technology,Tengzhou 277599,Shandong,China)

机构地区：[1]山东奥卓新材料有限公司,山东滕州277599 [2]北京理工大学鲁南研究院,山东滕州277599

出　　处：《中国胶粘剂》2024年第8期41-45,共5页China Adhesives

摘　　要：以聚丙烯酸酯压敏胶为基胶,加入齐聚物、多官能团活性稀释剂和光引发剂配制成胶液,然后涂敷于PET基膜上制备成UV光固化可剥离压敏胶带。研究了齐聚物、多官能团活性稀释剂和光引发剂的用量对胶带性能的影响,通过测试180°剥离强度、残胶情况优化出各组分最佳用量,并利用傅里叶红外光谱对其光固化过程进行了表征。研究结果表明:(1)聚丙烯酸酯胶粘剂129A基体为100份、齐聚物用量30份、活性稀释剂用量50份、光引发剂用量0.8份时,制备的UV固化可剥离型胶带减黏效果突出,无残胶,综合性能优异。与晶圆初始粘接力高达10.3 N/25 mm,经UV光照射后瞬间失黏,粘接力为0.3 N/25 mm,易剥离,满足芯片的特殊加工要求。(2)利用傅里叶红外光谱仪对光固化反应过程进行了表征。随着光固化过程的进行,碳碳双键的红外吸收峰逐渐减弱至消失,体系中发生了碳碳双键交联反应,形成交联结构,使胶由“黏”变为“失黏”。The UV-curing strippable pressure sensitive adhesive tape was prepared by using polyacrylate pressure sensitive adhesive as the base adhesive,adding oligomers,multifunctional active diluents,and photoinitiators to form the adhesive solution,and then coating it on the PET-based film.The influence of the dosage of oligomers,multifunctional active diluents and photoinitiators on the properties of adhesive tape was studied.The optimal dosage of each component was optimized by testing the 180° peel strength and residual adhesive situation,and the UV curing process was characterized by using Fourier transform infrared spectroscopy.The research results showed that,(1) When the matrix of polyacrylate adhesive 129A was 100 parts,the amount of oligomer was 30 parts,the amount of active diluent was 50 parts,and the amount of photoinitiator was 0.8 parts,the UV-curing strippable adhesive tape prepared had outstanding adhesive reduction effect,no residue,and excellent comprehensive performance.The initial adhesion force with the wafer was as high as 10.3 N/25 mm,but it instantly lost adhesion after UV light irradiation,with an adhesion force of 0.3 N/25 mm.It was easy to peel off and met the special processing requirements of the chip.(2) The UV curing reaction process was characterized by using Fourier transform infrared spectroscopy.As the light curing process progressed,the infrared absorption peak of the carbon-carbon double bond gradually weakened to disappeared,and the carbon-carbon double bond crosslinking reaction occurred in the system,forming the crosslinked structure and causing the adhesive to change from “sticky” to “non sticky”.

关 键 词：压敏胶 UV固化 齐聚物 活性稀释剂 

分 类 号：TQ436.3[化学工程]