GH3230合金TLP扩散连接动力学实验研究  

Experimental study on kinetics of TLP diffusion bonding of GH3230 alloy

作　　者：吴磊[1,2] 滕俊飞 吕彦龙 曲文卿 庄鸿寿[1] WU Lei;TENG Junfei;LYU Yanlong;QU Wenqing;ZHUANG Hongshou(School of Mechanical Engineering and Automation,Beihang University,Beijing 100191,China;Aviation Technology Key Laboratory of Aviation Welding and Joining Technology,AVIC Manufacturing Technology Institute,Beijing 100024,China)

机构地区：[1]北京航空航天大学机械工程及自动化学院,北京100191 [2]中国航空制造技术研究院航空焊接与连接技术航空科技重点实验室,北京100024

出　　处：《北京航空航天大学学报》2024年第8期2595-2600,共6页Journal of Beijing University of Aeronautics and Astronautics

摘　　要：过渡液相(TLP)扩散连接能够获得与母材组织性能相似的焊缝,因而成为航空发动机热端部件镍基高温合金结构的重要连接技术而被广泛应用。TLP扩散连接过程中液相的等温凝固形成不含析出物的固溶体组织是TLP扩散连接机制与过程动力学的核心环节,采用自行研制的镍基非晶态中间层针对GH3230合金的TLP扩散连接过程进行了研究试验,重点分析了不同连接时间条件下TLP扩散连接焊缝区域的元素扩散和分布特征,以中间层中Co元素为示踪原子,根据GH3230合金与中间层材料中的Co元素的含量分布状态判定等温凝固阶段前的液相最大宽度及等温凝固完成时间等重要参数,结果表明:液相最大宽度为72μm,GH3230合金在1180℃的焊接温度下TLP扩散连接等温凝固完成时间大于4 h。The transient liquid-phase(TLP)diffusion connection can obtain welds similar to the tissue performance of the parent material,so it has become an important bonding technology for the nickel-based superalloy structure of the aviation engine thermal end component and is widely used.The isothermal solidification of the liquid phase during the TLP diffusion bonding to form the solid solvent organization without the precipitates is the core link of the TLP diffusion bonding mechanism and the process dynamics.The TLP diffusion connection process of GH3230 alloy is carried out in the ways of an amorphous intermediate layer based on nickel by using the Co element in the middle layer as the tracer atom.The results focus on the element diffusion and distribution characteristics of the TLP diffusion bonding weld area under different connection time conditions.The maximum width of liquid phase is 72μm.At the welding temperature of 1180℃,the isothermal solidification time of TLP diffusion bonding is more than 4 h.

关 键 词：镍基高温合金 过渡液相扩散焊 等温凝固 液相最大宽度 微观组织 示踪原子 

分 类 号：TG453.9[金属学及工艺—焊接]