镀金盖板激光打标工艺研究  

Research on Laser Marking Technology for Gold-Plated Covers

作　　者：李云海 刘立恩 祁杰俊 赵星 LI Yun-hai;LIU Li-en;QI Jie-jun;ZHAO Xing Wuxi(Zhongwei High-tech Electronics Co.,Ltd)

机构地区：[1]无锡中微高科电子有限公司

出　　处：《中国集成电路》2024年第8期68-71,80,共5页China lntegrated Circuit

摘　　要：镀金盖板广泛应用于集成电路的气密性陶瓷封装中,其表面标识通常采用油墨移印工艺与激光打标工艺。油墨移印的标识在筛选或考核过程中时常发生字符脱落异常。激光打标工艺虽然可从根本上避免字符脱落异常,但目前字符可识别度略差于油墨移印工艺。本文对镀金盖板的激光打标参数进行研究,明确了镀金盖板最优的打标参数,改善了激光打标盖板存在的字符不清问题。对镀金盖板的激光标识区域进行电镜扫描和切片分析,结果表明标识区域镀金层厚度基本没有变化。使用优化后的参数制备的激光打标样品,顺利通过了按GJB548C要求进行的温度循环、热冲击、耐溶剂和盐雾等可靠性试验,在业内具有一定指导意义。Gold-plated covers are extensively utilized in the hermetic ceramic packaging of integrated circuits,where surface identification is commonly achieved through ink transfer printing and laser marking processes.Character detachment is frequently observed during screening or testing when using ink transfer printing.Laser marking,on the other hand,can prevent character detachment fundamentally,although its character recognition is currently slightly less effective than that of ink transfer printing.This study investigates the laser marking parameters for gold-plated covers,identifying the optimal parameters for marking and addressing the issue of unclear characters in laser-marked covers.The thickness of the gold plating layer in the laser-marked area on gold-plated covers is found to remain largely unchanged through scanning electron microscopy and cross-sectional analysis.Samples laser-marked with optimized parameters have successfully undergone reliability tests,including temperature cycling,thermal shock,solvent resistance,and salt spray,in accordance with GJB548C standards,offering guidance within the industry.

关 键 词：激光打标 镀金盖板 参数 效果 

分 类 号：TN249[电子电信—物理电子学] TN405