零应力温度和模型简化对CCGA器件寿命评估的影响  

Influence of Stress-free Temperature and Model Simplification in Life Evaluation of CCGA Packages

作　　者：冯明祥 蒋庆磊[1] 王旭艳[1] FENG Mingxiang;JIANG Qinglei;WANG Xuyan(The 14th Research Institute of China Electronics Technology Group Corporation,Nanjing 210039)

机构地区：[1]中国电子科技集团公司第十四研究所,南京210039

出　　处：《机械工程学报》2024年第12期268-276,共9页Journal of Mechanical Engineering

摘　　要：在有限元方法评估陶瓷柱栅阵列封装(Ceramic column grid array,CCGA)器件温度循环疲劳寿命的问题上,国内外相关研究对零应力温度取值存在不同意见,也存在较多不同的模型简化方法。针对上述问题,选取一种CCGA封装器件,使用有限元分析方法和Darveaux模型计算在不同零应力温度取值和不同的模型简化方法下的温度循环疲劳寿命。结果表明零应力温度取室温和温度循环试验的最高温度疲劳寿命计算差异小于0.1%,零应力温度取焊料凝固温度会轻微低估焊柱的温度循环疲劳寿命。缺省镀层铜箔、缺省部分印制电路板、片状模型和子模型简化方法均能得到相近的疲劳寿命计算结果,其中的片状模型简化方法在减少计算量上表现最突出,片状模型简化方法相比于初始模型可减少模型网格单元数量95%以上,且疲劳寿命计算结果偏差小于10%。Finite element analysis can be used to evaluate the thermal cycle fatigue life of ceramic column grid array(CCGA)packages,there are different opinions on the value of stress-free temperature and model simplification methods in relevant researches at home and abroad.Finite element analysis and Darveaux model are used to calculate the thermal cycle fatigue life of chosen CCGA package with different stress-free temperature and model simplification methods.The results show that the difference in the fatigue life calculation results is less than 0.1%when stress-free temperature equal to room temperature and the maximum temperature in thermal cycle test.Thermal cycle fatigue life is slightly underestimated when stress-free temperature equal to solder solidification temperature.Similar fatigue life calculation results can be obtained by omitting plating and copper foil,omitting part of printed circuit board,slice model and sub-model.The slice model performs best in reducing the amount of computer calculation.The number of model grid elements is reduced by 95%using slice model compared with initial model,and the deviation of the fatigue life calculation result is less than10%.

关 键 词：CCGA封装 有限元仿真 疲劳寿命 零应力温度 模型简化 

分 类 号：TG156[金属学及工艺—热处理]