滚镀参数对SnAgCu合金镀层形貌和厚度的影响  

Influence of Barrel Plating Parameter on Morphology and Thickness of SnAgCu Alloy Coating

作　　者：李少君 张雷 樊志斌 吕贤明 Li Shaojun;Zhang Lei;Fan Zhibin

机构地区：[1]宁波大学机械工程与力学学院,浙江宁波315211 [2]中国机械研究总院集团宁波智能机床研究院有限公司,浙江宁波315700

出　　处：《机械制造》2024年第8期69-74,共6页Machinery

基　　金：宁波市重大科技任务攻关项目(编号:2022Z103)。

摘　　要：为了在铜核球表层镀覆一定厚度的SnAgCu合金镀层,研究滚镀工艺参数对SnAgCu合金镀层形貌和厚度的影响。在已有的柠檬酸盐-硫脲体系电镀SnAgCu合金和前期研究基础上,固定镀液各成分浓度,分析电流密度、温度、酸碱值、滚筒转速、时间等滚镀工艺参数对微铜球表面SnAgCu合金镀层形貌和厚度的影响。研究表明,当电流密度为3A/dm^(2),温度为20~25℃,酸碱值为5.0~5.5,滚筒转速为12~14r/min时,可以在微铜球表面得到光亮、细致、均匀的SnAgCu合金镀层。In order to coat a certain thickness of SnAgCu alloy coating on the surface of the copper core sphere,the influence of barrel plating process parameter on the morphology and thickness of SnAgCu alloy coating was studied.On the basis of the existing citrate-thiourea system electroplating SnAgCu alloy and the previous research,the concentration of each component of the plating solution was fixed,and the influence of current density,temperature,pH value,drum speed,time and other barrel plating process parameters on the morphology and thickness of SnAgCu alloy coating on the surface of microcopper sphere was analyzed.The result shows that when the current density is 3A/dm^(2),the temperature is 20~25℃,the pH value is 5.0~5.5,and the drum speed is 12~14 r/min,a bright,fine and uniform SnAgCu alloy coating can be obtained on the surface of the microcopper sphere.

关 键 词：滚镀 参数合金 镀层 形貌 厚度 影响 

分 类 号：TQ153.2[化学工程—电化学工业]