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作 者:Bingrui LV Bin LIN Tianyi SUI Chunyan LIU Jinshuo ZHANG Longfei WANG Xuhui CHEN Jingguo ZHOU
机构地区:[1]Key Laboratory of Advanced Ceramics and Machining Technology,Ministry of Education,Tianjin University,Tianjin 300072,China [2]Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education,Tianjin University,Tianjin 300072,China [3]Science and Technology of Advanced Functional Composite Laboratory,Aerospace Research Institute of Materials and Processing Technology,Beijing 100076,China
出 处:《Chinese Journal of Aeronautics》2024年第8期527-546,共20页中国航空学报(英文版)
基 金:co-supported by the National Natural Science Foundation of China(Nos.52275458,and 52275207);the Natural Science Foundation of Tianjin(No.22JCZDJC00050).
摘 要:Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages.However,the damage and crack propagation mechanisms of materials in vibration-assisted grinding are not well understood.In order to elucidate the mechanism of abrasive scratching during vibration-assisted grinding,a kinematic model of vibration scratching was developed.The influence of process parameters on the evolution of vibration scratches to indentation or straight scratches is revealed by displacement metrics and velocity metrics.Indentation,scratch and vibration scratch experiments were performed on quartz glass,and the results showed that the vibration scratch cracks are a combination of indentation cracks and scratch cracks.Vibration scratch cracks change from indentation cracks to scratch cracks as the indenter moves from the entrance to the exit of the workpiece or as the vibration frequency changes from high to low.A vertical vibration scratch stress field model is established for the first time,which reveals that the maximum principal stress and tensile stress distribution is the fundamental cause for inducing the transformation of the vibration scratch cracking system.This model provides a theoretical basis for understanding of the mechanism of material damage and crack propagation during vibration-assisted grinding.
关 键 词:Vibration assisted grinding INDENTATION Vibration scratch Material removal mechanism Stress field model Crack propagation mechanism
分 类 号:V26[航空宇航科学与技术—航空宇航制造工程]
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