动态再结晶对纯镍热压连接界面结合率的影响  

Effect of dynamic recrystallization on healing at pure nickel joint interface during hot compression bonding

作　　者：仝珏川 袁瑶 仝大明[2] 郭正洪 顾剑锋[1,2] TONG Juechuan;YUAN Yao;TONG Daming;GUO Zhenghong;GU Jianfeng(Shanghai Key Laboratory of Laser Processing and Modification,Shanghai Jiao Tong University,Shanghai 200240,China;Institute of Materials Modification and Modelling,Shanghai Jiao Tong University,Shanghai 200240,China)

机构地区：[1]上海交通大学上海市激光制造与材料改性重点实验室,上海200240 [2]上海交通大学材料改性与数值模拟研究所,上海200240

出　　处：《中国有色金属学报》2024年第8期2708-2718,共11页The Chinese Journal of Nonferrous Metals

基　　金：国家重点研发计划资助项目(2018YFA0702900)。

摘　　要：为研究热压连接过程中显微组织演化与连接界面结合效果的关系,以纯镍试棒为载体进行单向热压模拟实验。通过采用不同温度和变形速率的组合,触发不同类型的不连续动态再结晶;对热压后的试棒进行室温拉伸测试和显微组织表征。结果表明:纯镍在动态再结晶过程中,当热压温度高至1100℃和热压变形速率低至0.001 s^(-1)的组合易于触发晶界弓出的再结晶方式,分体试棒连接界面的迁移效应显著,得到高的结合率;而当热压温度低至800℃和热压变形速率高至0.01 s^(-1)时易于产生亚晶合并的再结晶方式,其对界面迁移的影响相对较弱,分体试棒的界面结合率较低。亚晶合并耦合多相场法的界面迁移模型分析同样表明,亚晶合并形核仅能消除小角度晶界,而对大角度晶界(如连接界面)的消除效果较弱。In order to study the relationship between the microstructural evolution and the healing effect of the joint interface during hot compression bonding,the unidirectional hot compression was carried out with pure nickel bars.Different types of discontinuous dynamic recrystallization were triggered by the combination of different temperature and strain-rate.By mechanical test together with microstructural examination after hot compression,it was found that the mechanism of boundary bulging is more likely to work under the combination of temperature as high as 1100℃and strain-rate as low as 0.001 s^(-1),resulting in the significant migration effect of the joint interface for better healing quality.On the contrary,the mechanism of sub-grain coalescence will dominate gradually with the temperature as low as 800℃combined with the strain-rate as high as 0.01 s^(-1),which has relatively weak migration effect of the joint interface and thus corresponding to the low healing quality.Initial analysis by sub-grain coalescence model combined with multi-phase field method indicates sub-grain coalescence can only eliminate small angle grain boundaries effectively,the big angle grain boundaries similar to joint interface remain very stable both in structure and position during recrystallization.

关 键 词：热压连接 不连续动态再结晶 连接界面结合 再结晶形核类型 多相场法 

分 类 号：TG156[金属学及工艺—热处理]