有机硅改性酚醛树脂复合材料制备及性能研究  

Preparation and Properties of Organosilicon Modified Phenolic Resin Composite Materials

作　　者：孙晓东[1] Sun Xiaodong(Jiuquan Vocational Technical College,Jiuquan Gansu 735000,China)

机构地区：[1]酒泉职业技术学院,甘肃酒泉735000

出　　处：《山西化工》2024年第8期36-38,共3页Shanxi Chemical Industry

摘　　要：本文开展了有机硅改性酚醛树脂复合材料制备及性能研究。首先进行有机硅改性酚醛树脂复合材料的制备:将4 g甲基苯基二甲氧基硅烷溶于25 m L四甲基氢氧化铵中,然后将得到的料液添至去离子水中进行搅拌,得到黄色固体,并将其置于60℃烘箱中,设置时间24 h,得出有机硅改性酚醛树脂复合材料。再者,对有机硅改性酚醛树脂复合材料的热性能及复合材料层间剪切强度进行测试。研究结果表明:当固化环氧树脂和固化剂质量比为95∶5时,有机硅改性酚醛树脂复合材料性能最优,此时其层间剪切强度高达87.5 MPa,热失重质量为0.22 g,耐热性能更好。This article investigates the preparation and properties of organic silicon modified phenolic resin composite materials.Firstly,prepare the organic silicon modified phenolic resin composite material.Dissolve 4 g of methylphenyldimethoxysilane in 25 mL of tetramethylammonium hydroxide,then add the resulting solution to deionized water and stir to obtain a yellow solid.Place it in a 60℃oven for 24 hours to obtain the organic silicon modified phenolic resin composite material.Furthermore,the thermal properties and interlayer shear strength of organosilicon modified phenolic resin composite materials were tested.The research results show that when the mass ratio of cured epoxy resin to curing agent is 95:5,the performance of the organic silicon modified phenolic resin composite material is optimal.At this time,its interlayer shear strength is as high as 87.5 MPa,the thermal weight loss mass is 0.22 g,and the heat resistance is better.

关 键 词：有机硅 改性 酚醛树脂 复合材料 制备 性能 

分 类 号：O632.72[理学—高分子化学] TQ323.1[理学—化学]