交联/复合改性聚酰亚胺薄膜的制备及性能研究  

Preparation and Properties of Cross-linked/Composite Modified Polyimide Films

作　　者：刘明阳 LIU Ming-yang(Anhui Guofeng New Materials Co.Ltd.,Hefei 230088,China)

机构地区：[1]安徽国风新材料股份有限公司,安徽合肥230088

出　　处：《安徽化工》2024年第4期77-81,共5页Anhui Chemical Industry

摘　　要：基于含氟单体合成制备一种具有低介电特性的聚酰亚胺薄膜,并使用介孔二氧化硅进一步改性聚酰亚胺薄膜,探究介孔二氧化硅的加入对于聚酰亚胺薄膜的力学、热稳定性以及介电特性的影响。为了同时保持薄膜材料的可加工性,采用交联结构增强薄膜的机械性能与热稳定性能。结果表明:加入介孔氧化硅可以显著降低薄膜材料的介电常数与介质损耗,但是可能会对薄膜材料的机械性能产生不良影响;引入交联结构可以进一步增强薄膜材料的机械性能与热稳定性能;通过同时引入介孔氧化硅和交联结构可以同步提升薄膜材料的介电特性、机械性能以及热稳定性能。The polyimide thin films with low dielectric properties based on fluorinated monomers were synthesized and prepared,the thin films properties was further modified with mesoporous silica.The heat resistance,mechanical and dielectric properties of the thin films can be essentially understood on the basis of the effect of the addition of mesoporous silica fillers.In order to maintain the processability of the thin films,the cross-linked structure was used to enhance the mechanical properties and thermal stability of the films.The results indicated that the addition of mesoporous silica can significantly reduce the dielectric constant and dielectric loss,but may have adverse effects on the mechanical properties of the thin films.Introducing cross-linked structures can further enhance the mechanical properties and thermal stability of the thin films.By simultaneously introducing mesoporous silica and cross-linked structure,the dielectric properties,mechanical properties,and thermal stability of the thin films can be improved synchronously.

关 键 词：改性聚酰亚胺 低介电常数 含氟单体 介孔二氧化硅 交联结构 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业] TB332.2[一般工业技术—材料科学与工程]