液滴微流控技术制备B/CuO延期药微球及性能研究  

Preparation and Properties of B/CuO Delay Composition Microspheres by Droplet Microfluidic Technology

作　　者：杜尚昊 王凡 李冰洋 安崇伟 王晶禹 武碧栋 DU Shang-hao;WANG Fan;LI Bing-yang;AN Chong-wei;WANG Jing-yu;WU Bi-dong(School of Environmental and Safety Engineering,North University of China,Taiyuan,030051;Beijing Guoke Junrong Innovation Technology Co.Ltd.,Beijing,100176)

机构地区：[1]中北大学环境与安全工程学院,山西太原030051 [2]北京国科军融创新科技有限公司,北京100176

出　　处：《火工品》2024年第4期80-85,共6页Initiators & Pyrotechnics

基　　金：国家自然科学青年基金(No.22005275)。

摘　　要：为了探究B和CuO配比对延期药微球性能的影响,采用液滴微流控技术制备了B/CuO延期药微球,对微球的形貌、粒径分布和圆形度进行了表征,测试了微球的流散性、堆积密度、机械感度及燃烧性能,计算了线性燃速与延期精度。结果表明:液滴微流控技术制备的B/CuO微球元素分布均匀、粒径分布窄、流散性好、圆形度高;随着B质量分数从8.3%增大至20%,最大输出火焰温度提高了127.18℃,燃速从10.14 mm·s^(-1)升至17.58 mm·s^(-1),并在B质量分数为15%~20%时达到一个燃速平台期;当B质量分数为8.3%~11.9%时,反应不完全,有红褐色产物生成;与物理混合制备的样品相比,采用微流控技术制备的样品燃烧面平整,火焰平稳,燃速相对范围较小,延期精度较高。In order to investigate the effect of B and CuO proportion on the performance of delay composition microspheres,B/CuO delay composition microspheres were prepared by droplet microfluidic technology.The morphology,particle size distribution and circularity of the microspheres were characterized,and their flowability,packing density,mechanical sensitivity and combustion performance were tested.The linear buring rate and delay accuracy were calculated.The results show that the B/CuO microspheres prepared by droplet microfluidic technology have uniform elemental distribution,narrow particle size distribution,good dispersion and high circularity.With the increase of boron mass fraction from 8.3%to 20%,the maximum output flame temperature is increased by 127.18°C,the buring rate is increased from 10.14 mm·s^(-1)to 17.58 mm·s^(-1),and reaching a burning rate plateau at a B mass fraction of 15%~20%.When the B mass fraction is between 8.3%and 11.9%,the reaction is incomplete and a reddish brown product is generated;Compared with the sample prepared by physical mixing,the sample prepared by microfluidic technology has a smooth combustion surface,stable flame,smaller relative range of buring rate and higher delay accuracy.

关 键 词：延期药 液滴微流控技术 B/CuO 燃速 延期精度 

分 类 号：TJ55[兵器科学与技术—军事化学与烟火技术] TQ562[化学工程—炸药化工]