基于SiP技术多核处理器微系统设计  

Multi-core processor microsystem design based on SiP technology

作　　者：梁涛涛 李岩 刘振华 Liang Taotao;Li Yan;Liu Zhenhua(No.58 Research Institute of China Electronics Technology Group Corporation,Wuxi 214072,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214072

出　　处：《电子技术应用》2024年第9期83-88,共6页Application of Electronic Technique

摘　　要：系统级封装SiP(System in a Package)已成为后摩尔时代延续摩尔定律的主要技术路线,电子装备小型化和多功能化的推动,使其在领域具有广阔前景。描述了一种基于SiP技术小型化多核信号处理的实现方案,详细讲述了芯片级设计及封装的具体方法和思路,提出了一种基于SiP技术的多核处理器微系统设计及实现。System-in-package(SiP)has become the main technical route to continue Moore's law in the post-Moore era.Driven by the miniaturization and multi-functionality of electronic equipment,it has broad prospects in the field.This paper describes an implementation scheme for miniaturized multicore signal processing based on SiP technology.The specific methods and ideas of chip-level design and packaging are described in detail.The design and implementation of a multi-core processor microsystem based on SiP technology is proposed.

关 键 词：SIP 信号处理 DSP FPGA RDL 

分 类 号：TN402[电子电信—微电子学与固体电子学]