机构地区:[1]Department of Mechanical Engineering,Korea Advanced Institute of Science and Technology,Daejeon 34141,Republic of Korea [2]School of Electrical Engineering,Korea Advanced Institute of Science and Technology,Daejeon 34141,Republic of Korea [3]Advanced 3D Printing Technology Development Division,Korea Atomic Energy Research Institute,Daejeon 34057,Republic of Korea [4]Department of Electrical and Computer Engineering,University of Illinois at Urbana-Champaign,Urbana,IL 61801,USA [5]State Key Laboratory of Structural Analysis for Industrial Equipment,Department of Engineering Mechanics,Dalian University of Technology,Dalian 116023,P.R.China [6]Department of Mechanical Engineering,Northwestern University,Evanston,IL 60208,USA [7]DUT-BSU Joint Institute,Dalian University of Technology,Dalian 116023,China [8]Ningbo Institute of Dalian University of Technology,Ningbo 315016,China [9]Department of Electronics Engineering,Kangwon National University,Chuncheon 24341,Republic of Korea [10]Querrey-Simpson Institute for Bioelectronics,Northwestern University,Evanston,IL 60208,USA [11]Sibel Health Inc,Niles,IL 60714,USA [12]Department of Materials Science and Engineering,KAIST Institute for The Nanocentury(KINC),Korea Advanced Institute of Science and Technology,Daejeon 34141,Republic of Korea [13]Department of Rehabilitation Medicine,Gimhae Hansol Rehabilitation&Convalescent Hospital,Gimhae 50924,Republic of Korea [14]Department of planning and development,Gimhae Hansol Rehabilitation&Convalescent Hospital,Gimhae 50924,Republic of Korea [15]Department of rehabilitation medicine,Pusan national university hospital,Busan 49241,Republic of Korea [16]Department of AI Convergence Network,Ajou University,Suwon 16499,Republic of Korea [17]Department of Electronic Convergence Engineering,Kwangwoon University,Seoul 01897,Republic of Korea [18]Korea Photonics Technology Institute,Gwangju 61007,Republic of Korea [19]School of Biomedical Engineering,Korea University,Seoul 02841,Republic of Korea [20]Interdisciplinary Program in Precisi
出 处:《npj Flexible Electronics》2023年第1期479-493,共15页npj-柔性电子(英文)
基 金:supported by the Technology Innovation Program(00144157,Development of Heterogeneous Multi-Sensor Micro-System Platform)funded By the Ministry of Trade,Industry&Energy(MOTIE,korea)and the National Research Foundation of Korea(NRF)grant funded by the Korea government(MSIT)(no.2021R1A2C3008742);supported by the MSIT(Ministry of Science and ICT),Korea,under the Grand Information Technology Research Center support program(IITP-2022-2016-0-00318);supervised by the IITP(Institute for Information&communications Technology Planning&Evaluation)Z.X.acknowledges the support from the National Natural Science Foundation of China(Grant No.12072057).
摘 要:Individuals who are unable to walk independently spend most of the day in a wheelchair.This population is at high risk for developing pressure injuries caused by sitting.However,early diagnosis and prevention of these injuries still remain challenging.Herein,we introduce battery-free,wireless,multimodal sensors and a movable system for continuous measurement of pressure,temperature,and hydration at skin interfaces.The device design includes a crack-activated pressure sensor with nanoscale encapsulations for enhanced sensitivity,a temperature sensor for measuring skin temperature,and a galvanic skin response sensor for measuring skin hydration levels.The movable system enables power harvesting,and data communication to multiple wireless devices mounted at skin-cushion interfaces of wheelchair users over full body coverage.Experimental evaluations and numerical simulations of the devices,together with clinical trials for wheelchair patients,demonstrate the feasibility and stability of the sensor system for preventing pressure injuries caused by sitting.
分 类 号:TP212[自动化与计算机技术—检测技术与自动化装置]
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