聚醚类添加剂在5μm极薄电解铜箔制备中的影响  

Effect of Polyether Additives in Preparation of Ultra-thin Electrolytic Copper Foil(5μm)

作　　者：姬琳 樊斌锋 王庆福 李伟涛 JI Lin;FAN Binfeng;WANG Qingfu;LI Weitao(Henan High-Precision Copper Foil Industrial Technology Research Institute Co.,Ltd.,Lingbao 472500,Henan,China)

机构地区：[1]河南高精铜箔产业技术研究院有限公司,河南灵宝472500

出　　处：《矿冶工程》2024年第4期72-74,80,共4页Mining and Metallurgical Engineering

基　　金：河南省重点研发专项(231111241000)。

摘　　要：通过电化学、扫描电镜、X射线衍射仪研究了聚醚类添加剂对5μm极薄锂电铜箔性能的影响。结果表明,电解液中添加聚醚类添加剂能促使铜的沉积电位负移;适宜质量浓度的聚醚类添加剂能细化铜箔晶粒,有利于提高铜箔表面平整性;聚醚类添加剂质量浓度2.3 mg/L时,所得铜箔抗拉强度620.43 MPa,延伸率3.67%,光泽度161 GU,毛面粗糙度1.02μm,综合性能极好;高抗拉强度电解铜箔具有(111)晶面择优取向特征。The influence of polyether additives on performance of ultra-thin Li-ion battery copper foil with thickness of 5μm was studied by electrochemistry,scanning electron microscopy,and X-ray diffractometer.The results show that addition of polyether additives into electrolyte can promote negative shift of Cu deposition potential,and polyether additives with suitable concentration can lead to finer grains of copper foil,which is conducive to improving the surface flatness of copper foil.When the mass concentration of polyether additives is 2.3 mg/L,the obtained copper foil has tensile strength of 620.43 MPa,elongation of 3.67%,glossiness of 161 GU,and surface roughness of 1.02μm,presenting excellent overall performance.The electrolytic copper foil with high tensile strength has a preferred orientation of(111)plane.

关 键 词：锂电铜箔 聚醚类添加剂 电化学 抗拉强度 延伸率 光泽度 粗糙度 

分 类 号：TQ153.1[化学工程—电化学工业]