X射线纳米分辨立体成像及其在芯片表征中的应用  

X-Ray Nano-Resolution Stereo Imaging and Its Application in Chip Characterization

作　　者：刘聪[1,2] 王飞翔 陶芬 杜国浩 张玲 汪俊 邓彪 Liu Cong;Wang Feixiang;Tao Fen;Du Guohao;Zhang Ling;Wang Jun;Deng Biao(School of Microelectronics,ShanghaiUniversity,Shanghai 200444,China;Shanghai Synchrotron Radiation Facility,Shanghai Advanced Research Institute,Chinese Academy of Sciences,Shanghai 201204,China)

机构地区：[1]上海大学微电子学院,上海200444 [2]中国科学院上海高等研究院上海光源中心,上海201204

出　　处：《光学学报》2024年第13期324-332,共9页Acta Optica Sinica

基　　金：国家重点研发计划(2021YFA1601001);国家自然科学基金(U1932205,12275343)。

摘　　要：在芯片制造技术持续发展的背景下,对纳米量级检测的需求也随之急剧增加。然而,传统的光学、电镜和X射线检测技术都存在一定的局限性。本文提出了一种快速、无损、纳米分辨的立体成像技术,该技术基于上海光源纳米三维成像线站(BL18B)的透射X射线显微镜(TXM),结合双目立体视觉原理构建了X射线纳米分辨立体成像系统,通过归一化互相关(NCC)匹配算法获得了标准样品分辨率靶的线条宽度、长度及深度等信息。仿真结果和分辨靶实验所得深度信息与实际深度之间的归一化标准差分别为1.441×10^(-2)和8.11×10^(-4),验证了该方法获取样品深度信息的准确性。同时利用该方法实现了对芯片样品的精确检测,为芯片检测提供了一种新型纳米分辨无损解决方案。Objective With the development of chip manufacturing technology, the demand for nanoscale detection has also increased dramatically. However, traditional optical, electronic microscopy and X-ray detection technologies have their limitations such as insufficient resolution, causing sample damage, and the poor detection of internal structure, which have narrowed the applications of traditional technologies in nanoscale detection. We establish a new X-ray nano threedimensional(3D) imaging method on the X-ray nano 3D imaging line station(BL18B) of Shanghai Synchrotron Radiation Facility(SSRF). It can obtain the depth information that the traditional X-ray two-dimensional(2D) detection technology cannot gain, avoid the limitation of X-ray computer tomography(CT) technology on the sample, and reduce the time spent on reconstruction. The technology is applied to chip detection to acuqire the accurate size and depth of the micron-level defects inside the chip, showing the great potential of this method in chip detection.Methods The binocular stereo vision technology is based on the parallax principle. Two images of the object under test are captured from different perspectives by the imaging device, and the position deviation between the corresponding points in the images is calculated to extract the 3D geometric information of the object. The two projection images of the same object are obtained by two X-rays with an angle of θ, which is equivalent to using the single X-ray irradiation and the rotation of the sample by θ to obtain another projection image. Based on the two images, the depth information of the sample is restored using the parallax principle in binocular stereo vision to realize 3D reconstruction of the sample which is applied to defect detection. The experimental steps include selecting an appropriate stereo imaging perspective according to the shape of the sample and the characteristics of the region of interest, determining the binocular projection angle difference, and preprocessing the binocular im

关 键 词：X射线立体成像 透射X射线显微镜 纳米尺度分辨 芯片检测 

分 类 号：TG115.221.5[金属学及工艺—物理冶金]