多层PCB中高速信号传输路径的优化与仿真分析  

Optimization and Simulation Analysis of High-Speed Signal Transmission Path in Multi-Layer PCB

作　　者：陈巍 CHEN Wei(The 36th Research Institute of China Electronics Technology Corporation,Jiaxing 314000,China)

机构地区：[1]中国电子科技集团公司第三十六研究所,浙江嘉兴314000

出　　处：《通信电源技术》2024年第17期31-34,共4页Telecom Power Technology

摘　　要：针对多层印刷电路板(Printed Circuit Board,PCB)中高速信号传输路径优化问题,文章进行了系统性研究。采用高级设计工具与仿真软件,对多层PCB的高速信号传输路径进行优化设计和仿真分析,旨在解决信号完整性(Signal Integrity,SI)和电磁兼容性(Electro Magnetic Compatibility,EMC)问题。研究结果表明,优化后的传输路径显著提升了信号传输质量,降低了信号反射和串扰,信号传输速率达到10 Gb/s,信号损耗减少了15%。本研究的创新之处在于引入了多目标优化算法,并结合仿真工具实现了传输路径的精确优化,提高了多层PCB在高速信号传输中的性能和可靠性,具有重要的工程应用价值。Aiming at the optimization of high-speed signal transmission path in Printed Circuit Board(PCB),this paper makes a systematic study.Advanced design tools and simulation software are used to optimize the design and simulation analysis of high-speed signal transmission path of multilayer PCB,aiming at solving the problems of Signal Integrity(Si)and Electro Magnetic Compatibility(EMC).The research results show that the optimized transmission path significantly improves the signal transmission quality,reduces the signal reflection and crosstalk,and the signal transmission rate reaches 10 Gb/s,and the signal loss is reduced by 15%.The innovation of this research lies in the introduction of multi-objective optimization algorithm and the accurate optimization of transmission path combined with simulation tools,which improves the performance and reliability of multi-layer PCB in high-speed signal transmission and has important engineering application value.

关 键 词：高速信号传输 多层印刷电路板(PCB) 信号完整性(SI) 电磁兼容性(EMC) 

分 类 号：TN91[电子电信—通信与信息系统]