高温试验方法标准对比  

Comparison of High Temperature Test Method Standard

作　　者：王琪 WANG Qi(Wuhan Saibo Industrial Technology Research Institute Co.,Ltd.,Wuhan 430040,China)

机构地区：[1]武汉赛宝工业技术研究院有限公司,武汉430040

出　　处：《电子工艺技术》2024年第5期32-35,共4页Electronics Process Technology

摘　　要：电子产品的使用场景非常繁多,其中高温环境是必要的一环,无论是某些产品在使用过程中自生会发热或是处于高温环境中,都会影响产品的功能性能。因此需要对产品的抗高温能力进行考核。对高温试验方法相关标准涉及的试验参数及试验条件进行了分析研究,提出了几点注意事项,其目的是更好地为了产品研发和使用单位对产品抗高温能力的判断提高参考,为从事环境试验检测人员更好地了解高温试验方法提供了技术上的支持。There are many scenarios for the use of electronic products,among which a high temperature environment is necessary.Whether some products generate heat during use or are in a high temperature environment,it will affect the functional performance of the product.Therefore,it is necessary to assess high temperature resistance.An analysis and study are conducted on the test parameters and conditions involved in the relevant standards of high temperature test methods,and several points for attention are put forward.The purpose is to improve the reference for better product development and use of units to judge the high temperature resistance,and to provide technical support for personnel engaged in environmental testing to better understand the high temperature test method.

关 键 词：高温试验 试验方法 标准 

分 类 号：TN606[电子电信—电路与系统]