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作 者:任江燕 王修利[1] 吴广东[1] 刘晓剑 张宁[1] 甄红莹 谢月园 吕亮 张稳 王慎辉 REN Jiangyan;WANG Xiuli;WU Guangdong;LIU Xiaojian;ZHANG Ning;ZHEN Hongying;XIE Yueyuan;LYU Liang;ZHANG Wen;WANG Shenhui(Beijing Institute of Control Engineering,Beijing 100190)
出 处:《电子工艺技术》2024年第5期59-62,共4页Electronics Process Technology
摘 要:以质量大于3.5 g的轴向直插典型元器件CAK38系列钽电容和RX系列线绕电阻为主要研究对象,开展了不同安装方式、加固措施的方案对比。结果发现,采用贴板安装+绑扎后焊接软引线+硅橡胶的加固方式,元器件经过航天电子产品包络力学和热循环试验条件考核后,本体、引脚及焊点均无裂纹,满足可靠性要求。CAK38 series tantalum capacitor and RX series wire-wound resistor,typical axial in-line components with a mass greater than 3.5 g,are taken as the main research object,and different installation methods and reinforcement measures are compared.The results show that by using the reinforcement method of bonding board installation,binding and soldering soft lead and silicone rubber,the components are evaluated through the envelope mechanics and thermal cycling test conditions of aerospace electronic products,and there were no cracks in the body,pins,and solder joints,meeting the reliability requirements.
分 类 号:TN605[电子电信—电路与系统]
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