集成电路封装设计领域中一种高精度泪滴生成方法研究  

A High Precision Method for Teardrop Generation in the Field of Integrated Circuit Packaging Design

作　　者：吴声誉 朱俊辉 刘伊力 WU Sheng-yu;ZHU Jun-hui;LIU Yi-li(Shanghai RedEDA Co.,Ltd.)

机构地区：[1]上海弘快科技有限公司

出　　处：《中国集成电路》2024年第9期56-62,共7页China lntegrated Circuit

摘　　要：本文旨在应对集成电路封装设计领域中泪滴形成的高精度挑战,在探讨集成电路芯片封装过程中对于印刷电路板生产领域内泪滴技术存在的局限性进行深入分析的基础上,本文提出了一项提高泪滴形成精确度的新型方法。该技术在泪滴特性配置、初步处理、核心程序决策、准则操控等领域实现了重要进展,达到了泪滴构造的微观尺度精确度。本研究在技术层面展现了独创性并且在实践操作中显示了高效能、稳定性佳等优点,拥有宽广的商业成长空间。This study aims to address the high-precision challenge of teardrop formation in the field of integrated circuit packaging design.Based on the in-depth analysis of the limitations of teardrop technology in the field of printed circuit board production during the packaging process of integrated circuit chips,a new method for improving the accuracy of teardrop formation is proposed in this paper.The technology has achieved important progress in the fields of droplet characteristics configuration,preliminary processing,core program decision,criterion control and so on,and achieved micro-scale accuracy of droplet structure.This study demonstrates originality in the technical level and shows high efficiency and good stability in practical operation,and has broad commercial growth space.

关 键 词：集成电路封装设计 泪滴生成方法 EDA行业 高精度设计 

分 类 号：TN405[电子电信—微电子学与固体电子学]