屏蔽罩焊接造成阻焊膜剥离的研究  

Exploration and improvement of peeling defects of solder mask after shielding cover welding

作　　者：廖根望 王志远 郭双福 张怀雄 LIAO Genwang;WANG Zhiyuan;GUO Shuangfu;ZHANG Huaixiong(Jiyan Xinyang Electronics Co.,Ltd.,Ganzhou 341600,Jiangxi,China)

机构地区：[1]江西技研新阳电子有限公司,江西赣州341600

出　　处：《印制电路信息》2024年第9期1-4,共4页Printed Circuit Information

摘　　要：分析在新能源车载印制电路板(PCB)领域,屏蔽罩焊接造成阻焊膜剥离缺陷的原因。根据阻焊膜耐热特性,分别验证不同阻焊膜厚度、不同波长光固化、不同屏蔽罩设计及不同受热方式的影响。根据实验结果,最终得出需要通过设计防止屏蔽罩焊接过程热桥效应,增加阻焊膜附着力,有效杜绝屏蔽罩在焊接过程中的阻焊膜剥离不良。同时提出改善预防措施,给出了通过防止热桥效应,增加阻焊附着力改善焊接过程中阻焊膜剥离的方法。In the field of new energy vehicle printed circuit board(PCB),the causes of solder mask peeling defects caused by shield welding are analyzed.Based on the heat resistance characteristics of solder mask,different thicknesses of solder mask,different wavelengths for light curing,different shield design,and different heating methods are verified.Based on the experimental results,it is finally concluded that it is necessary to prevent thermal bridge effects during shield welding by special design,increasing the adhesion of solder mask,and effectively preventing the solder mask peeling during the welding process.The article also proposes improvement and preventive measures,and provides a detailed introduction to the method to improve the peeling of solder mask during the welding process by preventing thermal bridge effect and increasing solder mask adhesion.

关 键 词：屏蔽罩 耐热特性 热桥效应 光固化 

分 类 号：TN41[电子电信—微电子学与固体电子学]