PTFE基材铣切加工毛刺的改善研究  

Research on improvement of burrs in substrate milling process with PTFE material

作　　者：胡建华 凌胜利 吴六雄 袁锡志 HU Jianhua;LING Shengli;WU Liuxiong;YUAN Xizhi(Shennan Circuits Co.,Ltd.,Shenzhen 518117,Guangdong,China)

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2024年第9期10-14,共5页Printed Circuit Information

摘　　要：高频印制电路板(PCB)常用到聚四氟乙烯(PTFE)材料,这类基材外形铣切时容易产生毛刺。制定毛刺的企业内部标准,根据毛刺的产生机理将其分为4大类。以铣刀的铣削原理为基础,对PTFE材料4类毛刺的产生机理与改善方案展开研究,有效解决了PTFE板件外形加工过程中的毛刺问题。High frequency printed circuit boards(PCBs)use polytetrafluoroethylene(PTFE)material,which is prone to burrs during milling and cutting of the substrate shape.In view of the PTFE burrs generated during the milling process,we first establish the internal corporate standards for burrs,and divide them into four major categories according to the mechanism of burrs.Based on the milling principle of the milling cutter,the four major categories of burrs of PTFE materials are analyzed.Research on generating and improving solutions has effectively solved the burr problem during the milling process of PTFE boards.

关 键 词：印制电路板(PCB) 聚四氟乙烯(PTFE) 毛刺 铣削加工 铣削原理 

分 类 号：V261.41[航空宇航科学与技术—航空宇航制造工程]