中粗化微蚀药水引起化学镀镍/金不良的探讨  

Discussion on ENIG poor deposit defect caused by roughening micro-etch chemical

作　　者：唐小侠 徐卫祥 刘清 TANG Xiaoxia;XU Weixiang;LIU Qing(MFLEX Yancheng Co.,Ltd.,Yancheng 224000,Jiangsu,China)

机构地区：[1]盐城维信电子有限公司,江苏盐城224000

出　　处：《印制电路信息》2024年第9期19-24,共6页Printed Circuit Information

摘　　要：中粗化微蚀药水可以增加铜面粗糙度,改善阻焊油墨等在铜面的附着力。但在使用中发现,某款中粗化微蚀药水后直接印刷阻焊油墨,存在化镍金沉积不良问题。通过讨论中粗化微蚀药水引起化镍金沉积不良问题的机理,并经过测试验证,确定了化镍金沉积不良问题的改善方案。Roughening micro-etch chemical treated copper surface gets higher roughness,hence improving the adhesion between copper surface and solder mask,etc.But electroless nickel/immersion gold(ENIG)poor deposit defect was detected,after some type roughening micro-etch chemical was used without post-treatment and directly followed by the solder mask process.This article discussed the mechanism for roughening micro-etch chemical resulting in ENIG poor deposit defect.And based on test results,improvement measures are provided to prevent the ENIG poor deposit defect.

关 键 词：中粗化微蚀药水 阻焊油墨 化镍金沉积不良 

分 类 号：TQ153.13[化学工程—电化学工业]