陶瓷基微波PCB制造工艺性研究  

Study on the processing technology of the ceramic microwave PCB

作　　者：李敬科 杨维生 LI Jingke;YANG Weisheng(Dingqin Technology(Shenzhen)Co.,Ltd.,Shenzhen 518105,Guangdong,China;Nanjing Research Institute of Electronics Technology,Nanjing 210037,Jiangsu,China)

机构地区：[1]鼎勤科技(深圳)有限公司,广东深圳518105 [2]南京电子技术研究所,江苏南京210037

出　　处：《印制电路信息》2024年第9期25-30,共6页Printed Circuit Information

摘　　要：随着现代通信技术的飞速发展,越来越多的微波印制电路板(PCB)的设计和应用选择含有陶瓷粉填充的微波介质基板材料,以满足越来越严苛的设计性能指标,实现微波PCB的可加工性及应用场景可靠性的需求。世界著名的ROGERS公司推出了相对全系列的微波基板解决方案。介绍了2类陶瓷基微波介质材料(硬质陶瓷基板、软质陶瓷基板)的性能指标,在对2类陶瓷基微波介质材料的可加工性进行研究的基础上,阐述了陶瓷基微波介质基板材料的制造工艺流程;同时结合相关制造工序特点,对所采用的工艺技术的有效性进行了较为详细的论述。With the rapid development of modern communication technology,more and more microwave printed circuit boards(PCBs)are designed and applied,and microwave dielectric substrate materials filled with ceramic powder are selected to meet the requirements of more and more stringent design performance indicators,the processability of microwave PCBs,and the reliability of application scenarios.As a world-renowned company ROGERS,has launched a relatively full range of microwave substrate solutions.In this paper,the performance indicators of two types of ceramic based microwave dielectric materials(hard ceramic substrate and soft ceramic substrate)are introduced.Based on the research on the processability of the two types of ceramic based microwave dielectric materials,the manufacturing process of ceramic based microwave dielectric substrate is given.At the same time,the effectiveness of the technology used is discussed in detail according to the characteristics of related manufacturing processes.

关 键 词：微波 印制电路板 陶瓷 制造工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]