一种PCB的阶梯槽底部铜箔分层改善  

Improvement of copper foil delamination at the bottom of a stepped groove in a PCB

作　　者：徐胜 易雁 刘梦茹 XU Sheng;YAN Yi;LIU Mengru(Shengyi Electronics Co.,Ltd.,Dongguan 523127,Guangdong,China)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2024年第9期31-35,共5页Printed Circuit Information

摘　　要：使用CO_(2)激光加工阶梯槽时,树脂和槽底铜箔吸收CO_(2)激光后导致阶梯槽底铜箔温度上升,当阶梯槽底铜箔较薄或者铜箔与槽底基材结合不良时,往往会出现阶梯槽底铜箔与基材分层问题。对一种特殊叠构的阶梯槽设计进行试验,发现取消阶梯槽相连通孔设计、调整激光能量、更改铜箔类型等方式对此设计阶梯槽底的铜箔分层无改善,而通过更改叠层中铜箔与CO_(2)激光接触的面次可以改善阶梯槽底铜箔分层问题。此发现为后续类似产品的设计提供了依据,避免产品在制作过程中出现阶梯槽底部铜箔分层问题。When CO_(2) laser is used to process stepped grooves,the resin and copper foil at the bottom of the groove absorb CO_(2) laser energy,causing the temperature of the copper foil at the bottom of the stepped groove to rise.When the copper foil at the bottom of the stepped groove is thin or the copper foil is poorly combined with the substrate at the bottom of the groove,the problem of delamination between the copper foil at the bottom of the stepped groove and the substrate often appears.In this paper,it is found through experiments that the copper foil delamination at the bottom of stepped groove is not improved by canceling the design of through holes connected with stepped groove,adjusting the laser energy and changing the type of copper foil,but it can be improved by changing the contact side of copper foil with CO_(2) laser in the stack.This finding provides a basis for the design of similar products in the future,avoiding the delamination of copper foil at the bottom of the stepped groove during the production process.

关 键 词：印制电路板 阶梯槽 分层 激光能量 

分 类 号：TN41[电子电信—微电子学与固体电子学]