一种5G毫米波波束成形模块的设计与实现  

Design and implementation of a 5G millimeter wave beam forming module

作　　者：商锋 冯甲帝 SHANG Feng;FENG Jia Di(School of Electronic Engineering,Xi’an University of Posts and Telecommunications,Xi’an 710121,China;Shaanxi Beidou Weifeng Navigation Technology Co.,Ltd.,Xi’an 710100,China)

机构地区：[1]西安邮电大学电子工程学院,陕西西安710121 [2]陕西北斗伟丰导航技术有限公司,陕西西安710100

出　　处：《西安邮电大学学报》2024年第4期47-56,共10页Journal of Xi’an University of Posts and Telecommunications

基　　金：国防科技创新特区163计划项目(19-163-11-ZT-002-006-07)。

摘　　要：设计并实现了一种适用于第5代(5th Generation,5G)移动毫米波通信的波束成形模块。该模块由天线阵列辐射结构与波束成形电路集成一体化构成。在单层双极化微带贴片天线的基础上,使用叠层技术设计了7层的叠层微带天线结构,以实现拓展天线带宽以及与波束成形电路相集成的目的。采用波束成形芯片F5268以及微带并联分支线Wilkinson功分器构建波束成形电路。利用有限元法软件进行仿真及优化,得到天线的各项参数数值。仿真结果表明,设计天线各端口的阻抗带宽达到3.90 GHz,相对带宽达到14.9%。实测结果表明,设计的波束成形模块具有一定的波束扫描能力,水平方向最大波束扫描角度为-30°~+29°;垂直方向最大波束扫描角度为-20°~+18°。所提设计能够满足5G毫米波通信的应用要求。Design and implement a 5th generation(5G)mobile millimeter wave communication beam forming module.This module is composed of an integrated antenna array radiation structure and beamforming circuit.On the basis of single-layer dual polarization microstrip patch antenna,a 7-layer stacked microstrip antenna structure is designed using stacking technology to expand bandwidth and to integrate with beamforming circuits.Construct a beamforming circuit using a beamforming chip F5268 and a microstrip parallel branch Wilkinson power divider.Using finite element method software for simulation and optimization,to obtain the numerical values of various antenna parameters.Simulation results show that the impedance bandwidth of each port of the antenna reaches 3.90 GHz,with a relative bandwidth of 14.9%.The actual test results show that the designed module has a certain beam scanning ability,with a maximum horizontal beam scanning angle of-30°to+29°;the maximum vertical beam scanning angle is-20°to+18°.The proposed design can meet the requirements of 5G millimeter wave communication applications.

关 键 词：5G毫米波 叠层微带贴片天线 波束成形电路 波束扫描 集成技术 

分 类 号：TN82[电子电信—信息与通信工程]