对位芳纶纸的国内研究进展  

Domestic Research Progress of Para-aramid Paper

作　　者：于安军 范志平 靳高岭[2] 韩郡丰 武强强 YU Anjun;FAN Zhiping;JIN Gaoling;HAN Junfeng;WU Qiangqiang(Afchina Corporation Co.,Ltd.,Dongying 257345,Shandong,China;China Chemical Fibers Association,Beijing 100020,China)

机构地区：[1]中芳特纤股份有限公司,东营257345 [2]中国化学纤维工业协会,北京100020

出　　处：《高科技纤维与应用》2024年第4期20-24,共5页Hi-Tech Fiber and Application

摘　　要：对位芳纶纸基材料多是以短切纤维和芳纶浆粕或沉析纤维为原料,利用湿法抄造成纸,再经热压成型制得的高性能片状复合材料。因其密度小、抗冲击性好、耐腐蚀等特性在绝缘材料和电子材料领域得到广泛关注。本文综述了对位芳纶纸的制备方法、增强改性以及应用方面的研究进展。Para-aramid paper-based materials are mostly high-performance sheet-like composite materials made of chopped fibers and aramid pulp or fibrids as raw materials,employing a wet-papermaking process followed by not-pressing.Because of its low specific gravity,good impact resistance,corrosion resistance and other characteristics,it has received widespread attention in the fields of insulating materials and electronic materials.This article reviews the research progress on para-aramid paper preparation method,reinforcement modification and applications of aramid paper-based materials.

关 键 词：对位芳纶纸 研究进展 

分 类 号：TS761.2[轻工技术与工程—制浆造纸工程]