3D-printable Boron Nitride/Polyacrylic Hydrogel Composites with High Thermal Conductivities  

作　　者：DAI Jialei XUE Bingyu QIAN Qi HE Wenhao ZHU Chenglong LEI Liwen WANG Kun XIE Jingjing 戴加雷;王堃;解晶晶

机构地区：[1]Hubei Longzhong Laboratory,Xiangyang 441000,China [2]School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China [3]State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2024年第5期1303-1310,共8页武汉理工大学学报（材料科学英文版）

基　　金：Funed by the National Key Research and Development Program of China(No.2021YFA0715700);the Open Fund of Hubei Longzhong Laboratory。

摘　　要：Polyacrylic acid(PAA)hydrogel composites with different hexagonal boron nitride(h-BN)fillers were synthesized and successfully 3D-printed while their thermal conductivity was systematically studied.With the content of h-BN increasing from 0.1 wt%to 0.3 wt%,the thermal conductivity of the 3D-printed composites has been improved.Moreover,through the shear force given by the 3D printer,a complete thermal conductivity path is obtained inside the hydrogel,which significantly improves the thermal conductivity of the h-BN hydrogel composites.The maximum thermal conductivity is 0.8808 W/(m·K),leading to a thermal conductive enhancement of 1000%,compared with the thermal conductivity of pure PAA hydrogels.This study shows that using h-BN fillers can effectively and significantly improve the thermal conductivity of hydrogelbased materials while its 3D-printable ability has been maintained.

关 键 词：hydrogel composites boron nitride 3D printing thermal conductivity 

分 类 号：TB33[一般工业技术—材料科学与工程]