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作 者:GAO Ying LIU Di WANG Aiyang ZHANG Song HE Qianglong REN Shifeng FANG Jie WANG Zihan WANG Weimin 高颖;王为民
机构地区:[1]State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China [2]Jingdezhen Huaxun Special Ceramics Co.ltd.,Jingdezhen 333000,China [3]Aerospace Science&Industry Defense Technology Research and Test Center,Beijing 100854,China
出 处:《Journal of Wuhan University of Technology(Materials Science)》2024年第5期1319-1324,共6页武汉理工大学学报(材料科学英文版)
基 金:Funded by the Key Research and Development Plan of Jiangxi Province(No.2020ZDYFB0017);the National Key Research and Development Plan(No.2021YFB3701400);the National Natural Science Foundation of China((No.92163208)。
摘 要:Micrometer-sized diamonds were incorporated into silicon nitride(Si_(3)N_(4))matrix to manufacture high-performance Si_(3)N_(4)-based composites using spark plasma sintering at 1500℃under 50 MPa.The effects of the diamond content on the phase composition,microstructure,mechanical properties and thermal conductivity of the composites were investigated.The results showed that the addition of diamond could effectively improve the hardness of the material.The thermal conductivity of Si_(3)N_(4)increased to 52.97 W/m·k at the maximum with the addition of 15 wt%diamond,which was 27.5%higher than that of the monolithic Si_(3)N_(4).At this point,the fracture toughness was 7.54 MPa·m^(1/2).Due to the addition of diamond,the composite material generated a new substance,MgSiN2,which effectively combined Si_(3)N_(4)with diamond.MgSiN2 might improve the hardness and thermal conductivity of the materials.
关 键 词:spark plasma sintering Si_(3)N_(4) DIAMOND thermal conductivity mechanical properties
分 类 号:TB33[一般工业技术—材料科学与工程]
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