PI基材磁控溅射法制备柔性覆铜板的结合力优化研究  

Research on the Optimization of Adhesion of Flexible Copper Clad Laminates Prepared by Magnetron Sputtering Method on PI Substrate

作　　者：王恩泽 王顺花 尚伦霖 张广安[2] WANG Enze;WANG Shunhua;ZHANG Guangan;ZHANG Dongan(School of Materials Science and Engineering,Lanzhou Jiaotong University,Lanzhou 730070;State Key Laboratory of Solid Lubrication,Lanzhou Institute of Chemical Physics,Chinese Academy of Sciences,Lanzhou 730000)

机构地区：[1]兰州交通大学材料科学与工程学院,兰州730070 [2]中国科学院兰州化学物理研究所固体润滑国家重点实验室,兰州730000

出　　处：《宇航材料工艺》2024年第4期81-86,共6页Aerospace Materials & Technology

基　　金：中国科学院科技服务网络计划(No.20201600200092)。

摘　　要：采用磁控溅射法在聚酰亚胺薄膜表面沉积铜层广泛应用于柔性覆铜板的制备。目前,表面铜膜和聚酰亚胺基材结合强度低是磁控溅射法制备柔性覆铜板所面临的主要问题之一。本文提出通过对聚酰亚胺基材进行等离子体刻蚀处理和引入金属Cr结合层提高表面铜膜结合力,并对比研究不同等离子体刻蚀和金属Cr层对表面铜膜的微观结构、致密性、电阻率和结合力等方面的影响。结果表明,等离子体刻蚀使聚酰亚胺表面粗糙度和表面能增大,有利于铜膜沉积并在界面形成机械互锁和化学键而提高结合力;Cr金属中间层可在薄膜界面处形成固溶体强化结合力,达到最优的5B级别。本研究对解决磁控溅射法制备柔性覆铜板中铜膜和聚酰亚胺基材结合力差的问题具有重要的意义。The deposition of copper layers on polyimide films by magnetron sputtering is widely used in the preparation of flexible copper-clad laminates.At present,low bonding strength between the surface copper film and the polyimide substrate is one of the main problems faced by the magnetron sputtering method in the preparation of flexible copper-clad laminates.This paper proposes to improve the adhesion of copper film on the surface by plasma etching treatment of polyimide substrate and introducing a metal Cr bonding layer.It also compares and studies the effects of different plasma etching and metal Cr layers on the microstructure,density,resistivity,and adhesion of the surface copper film.The results show that plasma etching increases the surface roughness and surface energy of polyimide,which is beneficial for copper film deposition and forms mechanical interlocking and chemical bonds at the interface to improve adhesion.The Cr metal intermediate layer can form a solid solution at the film interface to strengthen the adhesion,reaching the optimal 5B level.This study is of great significance in solving the problem of poor adhesion between copper film and polyimide substrate in the preparation of flexible copper-clad laminates by magnetron sputtering.

关 键 词：聚酰亚胺 铜膜 结合力 FCCL 

分 类 号：O484.2[理学—固体物理]